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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
30-9513-10H

30-9513-10H

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

0 -
30-9513-10H

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 30 (2 x 15) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
110-99-322-41-001000

110-99-322-41-001000

CONN IC DIP SOCKET 22POS TINLEAD

Mill-Max Manufacturing Corp.

0 -
110-99-322-41-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-44-322-41-001000

110-44-322-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-44-322-41-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-44-422-41-001000

110-44-422-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-44-422-41-001000

数据表

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
917-41-103-41-001000

917-41-103-41-001000

CONN SKT TRANSISTOR

Mill-Max Manufacturing Corp.

0 -
917-41-103-41-001000

数据表

917 Tube Active Transistor, TO-5 3 (Round) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
210-11-308-41-001000

210-11-308-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
210-11-308-41-001000

数据表

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
HLS-0313-T-10

HLS-0313-T-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0313-T-10

数据表

HLS Tube Active SIP 39 (3 x 13) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
20-3508-30

20-3508-30

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-3508-30

数据表

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
16-8450-610C

16-8450-610C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
16-8450-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
16-8500-610C

16-8500-610C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
16-8500-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
HLS-0410-T-2

HLS-0410-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0410-T-2

数据表

HLS Bulk Active SIP 40 (4 x 10) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
210-99-324-41-001000

210-99-324-41-001000

CONN IC DIP SOCKET 24POS TINLEAD

Mill-Max Manufacturing Corp.

0 -
210-99-324-41-001000

数据表

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
210-99-624-41-001000

210-99-624-41-001000

CONN IC DIP SOCKET 24POS TINLEAD

Mill-Max Manufacturing Corp.

0 -
210-99-624-41-001000

数据表

210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
210-44-324-41-001000

210-44-324-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
210-44-324-41-001000

数据表

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
210-44-624-41-001000

210-44-624-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
210-44-624-41-001000

数据表

210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
65-PGM10008-10

65-PGM10008-10

CONN SOCKET PGA GOLD

Aries Electronics

0 -
65-PGM10008-10

数据表

PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
1-2013620-2

1-2013620-2

CONN SOCKET PGA ZIF 988POS GOLD

TE Connectivity AMP Connectors

0 -
1-2013620-2

数据表

- Tape & Reel (TR) Obsolete PGA, ZIF (ZIP) 988 (35 x 36) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame 0.039" (1.00mm) Solder 0.039" (1.00mm) - - Thermoplastic - Copper Alloy
110-93-210-41-105000

110-93-210-41-105000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

0 -
110-93-210-41-105000

数据表

110 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
510-83-221-18-091101

510-83-221-18-091101

CONN SOCKET PGA 221POS GOLD

Preci-Dip

0 -
510-83-221-18-091101

数据表

510 Bulk Active PGA 221 (18 x 18) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
ICA-624-ZHGT

ICA-624-ZHGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-624-ZHGT

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
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