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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
116-41-210-41-006000

116-41-210-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-41-210-41-006000

数据表

116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-91-210-41-006000

116-91-210-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-91-210-41-006000

数据表

116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
ICA-628-ZSGG-L

ICA-628-ZSGG-L

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-628-ZSGG-L

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
ICF-648-FM-O

ICF-648-FM-O

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-648-FM-O

数据表

ICF Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 3.00µin (0.076µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
ICF-648-F-O

ICF-648-F-O

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-648-F-O

数据表

ICF Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 3.00µin (0.076µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
714-43-135-31-018000

714-43-135-31-018000

CONN SOCKET SIP 35POS GOLD

Mill-Max Manufacturing Corp.

0 -
714-43-135-31-018000

数据表

714 Bulk Active SIP 35 (1 x 35) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 30.0µin (0.76µm) Brass Alloy
30-820-90C

30-820-90C

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

0 -
30-820-90C

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 30 (2 x 15) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
30-822-90C

30-822-90C

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

0 -
30-822-90C

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 30 (2 x 15) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
30-823-90C

30-823-90C

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

0 -
30-823-90C

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 30 (2 x 15) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
37-PGM10012-10

37-PGM10012-10

CONN SOCKET PGA GOLD

Aries Electronics

0 -
37-PGM10012-10

数据表

PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
510-87-361-19-000101

510-87-361-19-000101

CONN SOCKET PGA 361POS GOLD

Preci-Dip

0 -
510-87-361-19-000101

数据表

510 Bulk Active PGA 361 (19 x 19) Gold Flash Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
20-81000-610C

20-81000-610C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-81000-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
20-81250-610C

20-81250-610C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-81250-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
20-8400-610C

20-8400-610C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-8400-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
20-8500-610C

20-8500-610C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-8500-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
20-8675-610C

20-8675-610C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-8675-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
20-8724-610C

20-8724-610C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-8724-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
20-8950-610C

20-8950-610C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-8950-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
66-PGM11054-10

66-PGM11054-10

CONN SOCKET PGA GOLD

Aries Electronics

0 -
66-PGM11054-10

数据表

PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
48-6513-10H

48-6513-10H

CONN IC DIP SOCKET 48POS GOLD

Aries Electronics

0 -
48-6513-10H

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
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