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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
210-41-318-41-001000

210-41-318-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
210-41-318-41-001000

数据表

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
210-91-318-41-001000

210-91-318-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
210-91-318-41-001000

数据表

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-41-314-41-003000

115-41-314-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-41-314-41-003000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
210-47-424-41-001000

210-47-424-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
210-47-424-41-001000

数据表

210 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
ICO-640-ZMGT

ICO-640-ZMGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-640-ZMGT

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
HLS-0220-TT-18

HLS-0220-TT-18

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0220-TT-18

数据表

HLS Tube Active SIP 40 (2 x 20) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Tin Thermoplastic - -
317-47-110-41-005000

317-47-110-41-005000

STANDRD SOLDRTL SNG SKT

Mill-Max Manufacturing Corp.

0 -
317-47-110-41-005000

数据表

317 Bulk Active SIP 10 (1 x 10) Gold Flash Beryllium Copper Through Hole - 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
114-47-314-41-117000

114-47-314-41-117000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
114-47-314-41-117000

数据表

114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-41-420-41-001000

110-41-420-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-41-420-41-001000

数据表

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
68-PGM11032-10

68-PGM11032-10

CONN SOCKET PGA GOLD

Aries Electronics

0 -
68-PGM11032-10

数据表

PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
68-PGM11033-10

68-PGM11033-10

CONN SOCKET PGA GOLD

Aries Electronics

0 -
68-PGM11033-10

数据表

PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
68-PGM10006-10

68-PGM10006-10

CONN SOCKET PGA GOLD

Aries Electronics

0 -
68-PGM10006-10

数据表

PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
210-47-322-41-001000

210-47-322-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
210-47-322-41-001000

数据表

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold Flash Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
210-47-422-41-001000

210-47-422-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
210-47-422-41-001000

数据表

210 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold Flash Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-41-306-41-001000

614-41-306-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-306-41-001000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-91-306-41-001000

614-91-306-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-306-41-001000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
317-47-104-41-005000

317-47-104-41-005000

STANDRD SOLDRTL SNG SKT

Mill-Max Manufacturing Corp.

0 -
317-47-104-41-005000

数据表

317 Bulk Active SIP 4 (1 x 4) Gold Flash Beryllium Copper Through Hole - 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-47-420-41-001000

115-47-420-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
115-47-420-41-001000

数据表

115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
550-80-100-15-001101

550-80-100-15-001101

PGA SOLDER TAIL

Preci-Dip

0 -
550-80-100-15-001101

数据表

550 Bulk Active PGA 100 (15 x 15) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-47-318-41-605000

110-47-318-41-605000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0 -
110-47-318-41-605000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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