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IC 插座
| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量(网格) | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 配对间距 | 端接方式 | 引脚间距 | 工作温度 | 触点表面处理 - 引脚 | 外壳材料 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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110-43-640-41-801000CONN IC DIP SOCKET 40POS GOLD |
38 | - |
|
数据表 |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
110-93-640-41-801000CONN IC DIP SOCKET 40POS GOLD |
20 | - |
|
数据表 |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
FMC05DRTN-S1682CONN TRANSIST TO-220/TO-247 5POS |
9 | - |
|
数据表 |
- | Tray | Active | Transistor, TO-220 and TO-247 | 5 (Rectangular) | Gold | 30.0µin (0.76µm) | Nickel Boron | Through Hole | - | - | Solder | - | -65°C ~ 200°C | Gold | Polyphenylene Sulfide (PPS) | 30.0µin (0.76µm) | Nickel Boron |
|
APA-640-G-AADAPTER PLUG |
95 | - |
|
数据表 |
APA | Bulk | Active | - | 40 (2 x 20) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Polybutylene Terephthalate (PBT), Glass Filled | 20.0µin (0.51µm) | Phosphor Bronze |
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28-516-11CONN IC DIP SOCKET ZIF 28POS GLD |
43 | - |
|
数据表 |
516 | Bulk | Active | DIP, ZIF (ZIP) | 28 (2 x 14) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Beryllium Copper |
|
|
16-2820-90CCONN IC DIP SOCKET 16POS GOLD |
95 | - |
|
数据表 |
Vertisockets™ 800 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 16 (2 x 8) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
123-43-314-41-001000CONN IC DIP SOCKET 14POS GOLD |
89 | - |
|
数据表 |
123 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
28-526-11CONN IC DIP SOCKET ZIF 28POS GLD |
56 | - |
|
数据表 |
Lo-PRO®file, 526 | Bulk | Active | DIP, ZIF (ZIP) | 28 (2 x 14) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Beryllium Copper |
|
232-1285-00-0602JCONN IC DIP SOCKET ZIF 32POS GLD |
24 | - |
|
数据表 |
Textool™ | Tube | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | 0.100" (2.54mm) | Press-Fit | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polysulfone (PSU), Glass Filled | 30.0µin (0.76µm) | Beryllium Copper |
|
222-3343-00-0602JCONN IC DIP SOCKET ZIF 22POS GLD |
16 | - |
|
数据表 |
Textool™ | Tube | Active | DIP, ZIF (ZIP), 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | 0.100" (2.54mm) | Press-Fit | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polysulfone (PSU), Glass Filled | 30.0µin (0.76µm) | Beryllium Copper |
|
|
228-1290-00-0602JCONN IC DIP SOCKET ZIF 28POS GLD |
26 | - |
|
数据表 |
Textool™ | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | 0.070" (1.78mm) | Press-Fit | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polysulfone (PSU), Glass Filled | 30.0µin (0.76µm) | Beryllium Copper |
|
|
242-1281-00-0602JCONN IC DIP SOCKET ZIF 42POS GLD |
25 | - |
|
数据表 |
Textool™ | Tube | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | 0.100" (2.54mm) | Press-Fit | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polysulfone (PSU), Glass Filled | 30.0µin (0.76µm) | Beryllium Copper |
|
|
228-4817-00-0602JCONN IC DIP SOCKET ZIF 28POS GLD |
35 | - |
|
数据表 |
Textool™ | Bulk | Active | DIP, ZIF (ZIP), 0.4" (10.16mm) Row Spacing | 28 (2 x 14) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | 0.100" (2.54mm) | Press-Fit | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polysulfone (PSU), Glass Filled | 30.0µin (0.76µm) | Beryllium Copper |
|
|
242-1293-00-0602JCONN IC DIP SOCKET ZIF 42POS GLD |
15 | - |
|
数据表 |
Textool™ | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | 0.070" (1.78mm) | Press-Fit | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polysulfone (PSU), Glass Filled | 30.0µin (0.76µm) | Beryllium Copper |
|
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240-3639-00-0602JCONN IC DIP SOCKET ZIF 40POS GLD |
17 | - |
|
数据表 |
Textool™ | Bulk | Active | DIP, ZIF (ZIP), 1.0" (25.40mm) Row Spacing | 40 (2 x 20) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | 0.100" (2.54mm) | Press-Fit | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polysulfone (PSU), Glass Filled | 30.0µin (0.76µm) | Beryllium Copper |
|
220-7201-55-1902CONN SOCKET SOIC 20POS GOLD |
23 | - |
|
数据表 |
Textool™ | Bulk | Active | SOIC | 20 (2 x 10) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | - | Solder | - | -55°C ~ 150°C | Gold | Polyethersulfone (PES), Glass Filled | 30.0µin (0.76µm) | Beryllium Copper |
|
|
242-1289-00-0602JCONN IC DIP SOCKET ZIF 42POS GLD |
14 | - |
|
数据表 |
Textool™ | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | 0.100" (2.54mm) | Press-Fit | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polysulfone (PSU), Glass Filled | 30.0µin (0.76µm) | Beryllium Copper |
|
228-7396-55-1902CONN SOCKET SOIC 28POS GOLD |
19 | - |
|
数据表 |
Textool™ | Bulk | Active | SOIC | 28 (2 x 14) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | - | Solder | - | -55°C ~ 150°C | Gold | Polyethersulfone (PES), Glass Filled | 30.0µin (0.76µm) | Beryllium Copper |
|
|
228-7474-55-1902CONN SOCKET SOIC 28POS GOLD |
15 | - |
|
数据表 |
Textool™ | Bulk | Active | SOIC | 28 (2 x 14) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | - | Solder | - | -55°C ~ 150°C | Gold | Polyethersulfone (PES), Glass Filled | 30.0µin (0.76µm) | Beryllium Copper |
|
|
251-5949-01-0602CONN ZIG-ZAG ZIF 51POS GOLD |
7 | - |
|
数据表 |
Textool™ | Bulk | Active | Zig-Zag, ZIF (ZIP) | 51 (1 x 25, 1 x 26) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polysulfone (PSU), Glass Filled | 30.0µin (0.76µm) | Beryllium Copper |
