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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
110-43-640-41-801000

110-43-640-41-801000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

38 -
110-43-640-41-801000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-93-640-41-801000

110-93-640-41-801000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

20 -
110-93-640-41-801000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
FMC05DRTN-S1682

FMC05DRTN-S1682

CONN TRANSIST TO-220/TO-247 5POS

Sullins Connector Solutions

9 -
FMC05DRTN-S1682

数据表

- Tray Active Transistor, TO-220 and TO-247 5 (Rectangular) Gold 30.0µin (0.76µm) Nickel Boron Through Hole - - Solder - -65°C ~ 200°C Gold Polyphenylene Sulfide (PPS) 30.0µin (0.76µm) Nickel Boron
APA-640-G-A

APA-640-G-A

ADAPTER PLUG

Samtec Inc.

95 -
APA-640-G-A

数据表

APA Bulk Active - 40 (2 x 20) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 20.0µin (0.51µm) Phosphor Bronze
28-516-11

28-516-11

CONN IC DIP SOCKET ZIF 28POS GLD

Aries Electronics

43 -
28-516-11

数据表

516 Bulk Active DIP, ZIF (ZIP) 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Beryllium Copper
16-2820-90C

16-2820-90C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

95 -
16-2820-90C

数据表

Vertisockets™ 800 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
123-43-314-41-001000

123-43-314-41-001000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

89 -
123-43-314-41-001000

数据表

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
28-526-11

28-526-11

CONN IC DIP SOCKET ZIF 28POS GLD

Aries Electronics

56 -
28-526-11

数据表

Lo-PRO®file, 526 Bulk Active DIP, ZIF (ZIP) 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Beryllium Copper
232-1285-00-0602J

232-1285-00-0602J

CONN IC DIP SOCKET ZIF 32POS GLD

3M

24 -
232-1285-00-0602J

数据表

Textool™ Tube Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Gold Polysulfone (PSU), Glass Filled 30.0µin (0.76µm) Beryllium Copper
222-3343-00-0602J

222-3343-00-0602J

CONN IC DIP SOCKET ZIF 22POS GLD

3M

16 -
222-3343-00-0602J

数据表

Textool™ Tube Active DIP, ZIF (ZIP), 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Gold Polysulfone (PSU), Glass Filled 30.0µin (0.76µm) Beryllium Copper
228-1290-00-0602J

228-1290-00-0602J

CONN IC DIP SOCKET ZIF 28POS GLD

3M

26 -
228-1290-00-0602J

数据表

Textool™ Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame 0.070" (1.78mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Gold Polysulfone (PSU), Glass Filled 30.0µin (0.76µm) Beryllium Copper
242-1281-00-0602J

242-1281-00-0602J

CONN IC DIP SOCKET ZIF 42POS GLD

3M

25 -
242-1281-00-0602J

数据表

Textool™ Tube Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Gold Polysulfone (PSU), Glass Filled 30.0µin (0.76µm) Beryllium Copper
228-4817-00-0602J

228-4817-00-0602J

CONN IC DIP SOCKET ZIF 28POS GLD

3M

35 -
228-4817-00-0602J

数据表

Textool™ Bulk Active DIP, ZIF (ZIP), 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Gold Polysulfone (PSU), Glass Filled 30.0µin (0.76µm) Beryllium Copper
242-1293-00-0602J

242-1293-00-0602J

CONN IC DIP SOCKET ZIF 42POS GLD

3M

15 -
242-1293-00-0602J

数据表

Textool™ Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame 0.070" (1.78mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Gold Polysulfone (PSU), Glass Filled 30.0µin (0.76µm) Beryllium Copper
240-3639-00-0602J

240-3639-00-0602J

CONN IC DIP SOCKET ZIF 40POS GLD

3M

17 -
240-3639-00-0602J

数据表

Textool™ Bulk Active DIP, ZIF (ZIP), 1.0" (25.40mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Gold Polysulfone (PSU), Glass Filled 30.0µin (0.76µm) Beryllium Copper
220-7201-55-1902

220-7201-55-1902

CONN SOCKET SOIC 20POS GOLD

3M

23 -
220-7201-55-1902

数据表

Textool™ Bulk Active SOIC 20 (2 x 10) Gold - Beryllium Copper Through Hole Closed Frame - Solder - -55°C ~ 150°C Gold Polyethersulfone (PES), Glass Filled 30.0µin (0.76µm) Beryllium Copper
242-1289-00-0602J

242-1289-00-0602J

CONN IC DIP SOCKET ZIF 42POS GLD

3M

14 -
242-1289-00-0602J

数据表

Textool™ Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Gold Polysulfone (PSU), Glass Filled 30.0µin (0.76µm) Beryllium Copper
228-7396-55-1902

228-7396-55-1902

CONN SOCKET SOIC 28POS GOLD

3M

19 -
228-7396-55-1902

数据表

Textool™ Bulk Active SOIC 28 (2 x 14) Gold - Beryllium Copper Through Hole Closed Frame - Solder - -55°C ~ 150°C Gold Polyethersulfone (PES), Glass Filled 30.0µin (0.76µm) Beryllium Copper
228-7474-55-1902

228-7474-55-1902

CONN SOCKET SOIC 28POS GOLD

3M

15 -
228-7474-55-1902

数据表

Textool™ Bulk Active SOIC 28 (2 x 14) Gold - Beryllium Copper Through Hole Closed Frame - Solder - -55°C ~ 150°C Gold Polyethersulfone (PES), Glass Filled 30.0µin (0.76µm) Beryllium Copper
251-5949-01-0602

251-5949-01-0602

CONN ZIG-ZAG ZIF 51POS GOLD

3M

7 -
251-5949-01-0602

数据表

Textool™ Bulk Active Zig-Zag, ZIF (ZIP) 51 (1 x 25, 1 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polysulfone (PSU), Glass Filled 30.0µin (0.76µm) Beryllium Copper
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