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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
12-6810-90C

12-6810-90C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

45 -
12-6810-90C

数据表

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Vertical Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
APA-640-T-B

APA-640-T-B

ADAPTER PLUG

Samtec Inc.

100 -
APA-640-T-B

数据表

APA Bulk Active - 40 (2 x 20) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
APA-640-G-A1

APA-640-G-A1

ADAPTER PLUG

Samtec Inc.

98 -
APA-640-G-A1

数据表

APA Bulk Active - 40 (2 x 20) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 20.0µin (0.51µm) Phosphor Bronze
28-823-90C

28-823-90C

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

7 -
28-823-90C

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
299-93-628-10-002000

299-93-628-10-002000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

56 -
299-93-628-10-002000

数据表

299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-13-640-41-801000

110-13-640-41-801000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

30 -
110-13-640-41-801000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
APA-316-G-P

APA-316-G-P

ADAPTER PLUG

Samtec Inc.

26 -
APA-316-G-P

数据表

APA Tube Active - 16 (2 x 8) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 20.0µin (0.51µm) Phosphor Bronze
40-516-11

40-516-11

CONN IC DIP SOCKET ZIF 40POS GLD

Aries Electronics

20 -
40-516-11

数据表

516 Bulk Active DIP, ZIF (ZIP) 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Beryllium Copper
110-13-324-41-801000

110-13-324-41-801000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

55 -
110-13-324-41-801000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
209-PGM17020-10

209-PGM17020-10

CONN SOCKET PGA GOLD

Aries Electronics

8 -
209-PGM17020-10

数据表

PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
2-2129710-8

2-2129710-8

CONN SOCKET LGA 3647POS GOLD

TE Connectivity AMP Connectors

34 -
2-2129710-8

数据表

- Tray Active LGA 3647 Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame - Solder - - - Thermoplastic - Copper Alloy
256-1292-00-0602J

256-1292-00-0602J

CONN IC DIP SOCKET ZIF 56POS GLD

3M

13 -
256-1292-00-0602J

数据表

Textool™ Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 56 (2 x 28) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame 0.070" (1.78mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Gold Polysulfone (PSU), Glass Filled 30.0µin (0.76µm) Beryllium Copper
260-4204-01

260-4204-01

CONN SOCKET QFN 60POS GOLD

3M

14 -
260-4204-01

数据表

Textool™ Bulk Active QFN 60 (4 x 15) Gold - Beryllium Copper Through Hole Open Frame 0.016" (0.40mm) Solder 0.016" (0.40mm) - Gold Polyethersulfone (PES) - Beryllium Copper
ICO-314-STT

ICO-314-STT

CONN IC DIP SOCKET 14POS TIN

Samtec Inc.

68 -
ICO-314-STT

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyester, Glass Filled - Brass
123-83-314-41-001101

123-83-314-41-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

30 -
123-83-314-41-001101

数据表

123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
4590

4590

CONN TRANSIST TO-5 3POS TIN

Keystone Electronics

58 -
4590

数据表

- Bulk Active Transistor, TO-5 3 (Round) Tin - Brass Chassis Mount Closed Frame - Solder - - Tin Polyester, Glass Filled - Brass
APA-314-T-A1

APA-314-T-A1

ADAPTER PLUG

Samtec Inc.

98 -
APA-314-T-A1

数据表

APA Bulk Active - 14 (2 x 7) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
299-83-308-10-001101

299-83-308-10-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

47 -
299-83-308-10-001101

数据表

299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
ICO-320-MTT

ICO-320-MTT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

66 -
ICO-320-MTT

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyester, Glass Filled - Brass
XR2C-2015

XR2C-2015

CONN SOCKET SIP 20POS GOLD

Omron Electronics Inc-EMC Div

43 -
XR2C-2015

数据表

XR2 Bulk Active SIP 20 (1 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polybutylene Terephthalate (PBT), Glass Filled 10.0µin (0.25µm) Beryllium Copper
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