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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
546-83-085-11-002136

546-83-085-11-002136

CONN SOCKET PGA 85POS GOLD

Preci-Dip

0 -
546-83-085-11-002136

数据表

546 Bulk Active PGA 85 (11 x 11) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.050" (1.27mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Bronze
20-810-90TWR

20-810-90TWR

CONN IC DIP SOCKET 20POS TIN

Aries Electronics

0 -
20-810-90TWR

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Phosphor Bronze
146-41-308-41-012000

146-41-308-41-012000

CONN SKT DBL

Mill-Max Manufacturing Corp.

0 -
146-41-308-41-012000

数据表

146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
146-91-308-41-012000

146-91-308-41-012000

CONN SKT DBL

Mill-Max Manufacturing Corp.

0 -
146-91-308-41-012000

数据表

146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
104-13-306-41-770000

104-13-306-41-770000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.

0 -
104-13-306-41-770000

数据表

104 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) - Gold Thermoplastic 10.0µin (0.25µm) Brass Alloy
110-43-210-41-001000

110-43-210-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-43-210-41-001000

数据表

110 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
ICA-320-ZWGG-2

ICA-320-ZWGG-2

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-320-ZWGG-2

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
ICF-328-STL-I

ICF-328-STL-I

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-328-STL-I

数据表

ICF Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Tin - Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
ICF-628-STL-O

ICF-628-STL-O

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-628-STL-O

数据表

ICF Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Tin - Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
ICF-648-TL-O

ICF-648-TL-O

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-648-TL-O

数据表

ICF Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Tin - Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
APH-0918-T-T

APH-0918-T-T

APH-0918-T-T

Samtec Inc.

0 -
APH-0918-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1018-T-T

APH-1018-T-T

APH-1018-T-T

Samtec Inc.

0 -
APH-1018-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1718-T-T

APH-1718-T-T

APH-1718-T-T

Samtec Inc.

0 -
APH-1718-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0718-T-T

APH-0718-T-T

APH-0718-T-T

Samtec Inc.

0 -
APH-0718-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0318-T-T

APH-0318-T-T

APH-0318-T-T

Samtec Inc.

0 -
APH-0318-T-T

数据表

* - Active - - - - - - - - - - - - - - -
116-41-308-41-006000

116-41-308-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-41-308-41-006000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-91-308-41-006000

116-91-308-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-91-308-41-006000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
917-41-103-41-005000

917-41-103-41-005000

CONN SKT TRANSISTOR

Mill-Max Manufacturing Corp.

0 -
917-41-103-41-005000

数据表

917 Tube Active Transistor, TO-5 3 (Round) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
917-91-103-41-005000

917-91-103-41-005000

CONN SKT TRANSISTOR

Mill-Max Manufacturing Corp.

0 -
917-91-103-41-005000

数据表

917 Tube Active Transistor, TO-5 3 (Round) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-83-642-41-013101

116-83-642-41-013101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

0 -
116-83-642-41-013101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
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