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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APH-0822-T-H

APH-0822-T-H

APH-0822-T-H

Samtec Inc.

0 -
APH-0822-T-H

数据表

* - Active - - - - - - - - - - - - - - -
ICO-632-ZCGT

ICO-632-ZCGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-632-ZCGT

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
28-6511-11

28-6511-11

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
28-6511-11

数据表

511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
116-47-308-41-006000

116-47-308-41-006000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
116-47-308-41-006000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-41-306-41-008000

116-41-306-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-41-306-41-008000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-91-306-41-008000

116-91-306-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-91-306-41-008000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
HLS-0211-G-11

HLS-0211-G-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0211-G-11

数据表

HLS Tube Active SIP 22 (2 x 11) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
828-AG12D

828-AG12D

CONN IC DIP SOCKET 28POS TINLEAD

TE Connectivity AMP Connectors

0 -
828-AG12D

数据表

800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Tin-Lead - Copper Alloy Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin-Lead Polyester - Copper Alloy
24-3503-30

24-3503-30

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-3503-30

数据表

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
22-0503-20

22-0503-20

CONN SOCKET SIP 22POS GOLD

Aries Electronics

0 -
22-0503-20

数据表

0503 Bulk Active SIP 22 (1 x 22) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Tin Polyamide (PA), Nylon, Glass Filled 200.0µin (5.08µm) Brass
22-0503-30

22-0503-30

CONN SOCKET SIP 22POS GOLD

Aries Electronics

0 -
22-0503-30

数据表

0503 Bulk Active SIP 22 (1 x 22) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Tin Polyamide (PA), Nylon, Glass Filled 200.0µin (5.08µm) Brass
317-91-106-41-005000

317-91-106-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.

0 -
317-91-106-41-005000

数据表

317 Bulk Active SIP 6 (1 x 6) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
HLS-0213-G-11

HLS-0213-G-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0213-G-11

数据表

HLS Tube Active SIP 26 (2 x 13) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
317-43-106-41-005000

317-43-106-41-005000

CONN SKT STRIP

Mill-Max Manufacturing Corp.

0 -
317-43-106-41-005000

数据表

317 Tube Active SIP 6 (1 x 6) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
210-47-318-41-001000

210-47-318-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
210-47-318-41-001000

数据表

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold Flash Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-41-310-41-006000

116-41-310-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-41-310-41-006000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-91-310-41-006000

116-91-310-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-91-310-41-006000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
ICA-320-ZWGG-3

ICA-320-ZWGG-3

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-320-ZWGG-3

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
33-0508-20

33-0508-20

CONN SOCKET SIP 33POS GOLD

Aries Electronics

0 -
33-0508-20

数据表

508 Bulk Active SIP 33 (1 x 33) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
33-0508-30

33-0508-30

CONN SOCKET SIP 33POS GOLD

Aries Electronics

0 -
33-0508-30

数据表

508 Bulk Active SIP 33 (1 x 33) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
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