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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APH-1508-G-R

APH-1508-G-R

APH-1508-G-R

Samtec Inc.

0 -
APH-1508-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1908-G-R

APH-1908-G-R

APH-1908-G-R

Samtec Inc.

0 -
APH-1908-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1008-G-R

APH-1008-G-R

APH-1008-G-R

Samtec Inc.

0 -
APH-1008-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0608-G-R

APH-0608-G-R

APH-0608-G-R

Samtec Inc.

0 -
APH-0608-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1108-G-R

APH-1108-G-R

APH-1108-G-R

Samtec Inc.

0 -
APH-1108-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0208-G-R

APH-0208-G-R

APH-0208-G-R

Samtec Inc.

0 -
APH-0208-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1608-G-R

APH-1608-G-R

APH-1608-G-R

Samtec Inc.

0 -
APH-1608-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0308-G-R

APH-0308-G-R

APH-0308-G-R

Samtec Inc.

0 -
APH-0308-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1808-G-R

APH-1808-G-R

APH-1808-G-R

Samtec Inc.

0 -
APH-1808-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0808-G-R

APH-0808-G-R

APH-0808-G-R

Samtec Inc.

0 -
APH-0808-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0408-G-R

APH-0408-G-R

APH-0408-G-R

Samtec Inc.

0 -
APH-0408-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APA-308-G-B

APA-308-G-B

ADAPTER PLUG

Samtec Inc.

0 -
APA-308-G-B

数据表

APA Bulk Active - 8 (2 x 4) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 20.0µin (0.51µm) Phosphor Bronze
APO-308-G-B

APO-308-G-B

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-308-G-B

数据表

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 10.0µin (0.25µm) Phosphor Bronze
25-0508-20

25-0508-20

CONN SOCKET SIP 25POS GOLD

Aries Electronics

0 -
25-0508-20

数据表

508 Bulk Active SIP 25 (1 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
25-0508-30

25-0508-30

CONN SOCKET SIP 25POS GOLD

Aries Electronics

0 -
25-0508-30

数据表

508 Bulk Active SIP 25 (1 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
40-3513-11

40-3513-11

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-3513-11

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
22-4508-20

22-4508-20

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

0 -
22-4508-20

数据表

508 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
22-4508-30

22-4508-30

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

0 -
22-4508-30

数据表

508 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
14-6810-90C

14-6810-90C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
14-6810-90C

数据表

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Vertical Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
836-AG11D

836-AG11D

CONN IC DIP SOCKET 36POS GOLD

TE Connectivity AMP Connectors

0 -
836-AG11D

数据表

800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C - Polyester - -
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