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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
115-41-306-41-001000

115-41-306-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-41-306-41-001000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-91-306-41-001000

115-91-306-41-001000

SKT IC OPEN LOWPRO

Mill-Max Manufacturing Corp.

0 -
115-91-306-41-001000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
32-6518-11H

32-6518-11H

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

0 -
32-6518-11H

数据表

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
550-10-056-09-041101

550-10-056-09-041101

PGA SOLDER TAIL

Preci-Dip

0 -
550-10-056-09-041101

数据表

550 Bulk Active PGA 56 (9 x 9) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 10.0µin (0.25µm) Brass
40-C182-11

40-C182-11

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-C182-11

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
40-C212-11

40-C212-11

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-C212-11

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
40-C300-11

40-C300-11

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-C300-11

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
40-6513-10H

40-6513-10H

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-6513-10H

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
ICA-628-WGT

ICA-628-WGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-628-WGT

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
APH-0512-T-H

APH-0512-T-H

APH-0512-T-H

Samtec Inc.

0 -
APH-0512-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1512-T-H

APH-1512-T-H

APH-1512-T-H

Samtec Inc.

0 -
APH-1512-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0612-T-H

APH-0612-T-H

APH-0612-T-H

Samtec Inc.

0 -
APH-0612-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0212-T-H

APH-0212-T-H

APH-0212-T-H

Samtec Inc.

0 -
APH-0212-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0312-T-H

APH-0312-T-H

APH-0312-T-H

Samtec Inc.

0 -
APH-0312-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1312-T-H

APH-1312-T-H

APH-1312-T-H

Samtec Inc.

0 -
APH-1312-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1212-T-H

APH-1212-T-H

APH-1212-T-H

Samtec Inc.

0 -
APH-1212-T-H

数据表

* - Active - - - - - - - - - - - - - - -
ICA-422-ZHGT

ICA-422-ZHGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-422-ZHGT

数据表

ICA Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
18-81000-310C

18-81000-310C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-81000-310C

数据表

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
18-81250-310C

18-81250-310C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-81250-310C

数据表

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
18-8250-310C

18-8250-310C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-8250-310C

数据表

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
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