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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APH-0412-T-T

APH-0412-T-T

APH-0412-T-T

Samtec Inc.

0 -
APH-0412-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0712-T-T

APH-0712-T-T

APH-0712-T-T

Samtec Inc.

0 -
APH-0712-T-T

数据表

* - Active - - - - - - - - - - - - - - -
824-AG12D-LF

824-AG12D-LF

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors

0 -
824-AG12D-LF

数据表

- Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin - - Brass
510-87-324-18-000101

510-87-324-18-000101

CONN SOCKET PGA 324POS GOLD

Preci-Dip

0 -
510-87-324-18-000101

数据表

510 Bulk Active PGA 324 (18 x 18) Gold Flash Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
19-0501-20

19-0501-20

CONN SOCKET SIP 19POS TIN

Aries Electronics

0 -
19-0501-20

数据表

501 Bulk Active SIP 19 (1 x 19) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
19-0501-30

19-0501-30

CONN SOCKET SIP 19POS TIN

Aries Electronics

0 -
19-0501-30

数据表

501 Bulk Active SIP 19 (1 x 19) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
510-87-309-21-001101

510-87-309-21-001101

CONN SOCKET PGA 309POS GOLD

Preci-Dip

0 -
510-87-309-21-001101

数据表

510 Bulk Active PGA 309 (21 x 21) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
ICA-632-KGT

ICA-632-KGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-632-KGT

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
40-6518-111

40-6518-111

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-6518-111

数据表

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
ICA-322-WGG-2

ICA-322-WGG-2

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-322-WGG-2

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
ICA-318-ZHGT

ICA-318-ZHGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-318-ZHGT

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
ICO-632-ZAGT

ICO-632-ZAGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-632-ZAGT

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
PGA175H010B5-1620R

PGA175H010B5-1620R

PGA SOCKET 175 CTS

Amphenol ICC (FCI)

0 -
PGA175H010B5-1620R

数据表

- - Active PGA 175 (16 x 16) Gold 30.0µin (0.76µm) - Through Hole Open Frame 0.100" (2.54mm) - - - - - - -
APO-318-T-T

APO-318-T-T

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-318-T-T

数据表

* - Active - - - - - - - - - - - - - - -
20-8865-310C

20-8865-310C

CONN ELEVATOR SOCKET 20 PO .300

Aries Electronics

0 -
20-8865-310C

数据表

8 - Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
299-83-632-10-002101

299-83-632-10-002101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
299-83-632-10-002101

数据表

299 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
28-3518-10E

28-3518-10E

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
28-3518-10E

数据表

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
18-6820-90

18-6820-90

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-6820-90

数据表

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Phosphor Bronze
ICO-632-NGT

ICO-632-NGT

CONN IC DIP SOCKET 32POS GOLD

Samtec Inc.

0 -
ICO-632-NGT

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
346-93-139-41-013000

346-93-139-41-013000

CONN SOCKET SIP 39POS GOLD

Mill-Max Manufacturing Corp.

0 -
346-93-139-41-013000

数据表

346 Bulk Active SIP 39 (1 x 39) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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