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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
24-3551-10

24-3551-10

CONN IC DIP SOCKET ZIF 24POS TIN

Aries Electronics

0 -
24-3551-10

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
APO-320-T-H

APO-320-T-H

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-320-T-H

数据表

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
ICO-422-ZMGG

ICO-422-ZMGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-422-ZMGG

数据表

ICO Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
940-44-068-17-400004

940-44-068-17-400004

CONN SKT PLCC

Mill-Max Manufacturing Corp.

0 -
940-44-068-17-400004

数据表

940 Tape & Reel (TR) Active PLCC 68 (4 x 17) Tin 150.0µin (3.81µm) Beryllium Copper Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
12-0511-11

12-0511-11

CONN SOCKET SIP 12POS GOLD

Aries Electronics

0 -
12-0511-11

数据表

511 Bulk Active SIP 12 (1 x 12) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
517-87-183-14-091111

517-87-183-14-091111

CONN SOCKET PGA 183POS GOLD

Preci-Dip

0 -
517-87-183-14-091111

数据表

517 Bulk Active PGA 183 (14 x 14) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
14-C195-20

14-C195-20

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
14-C195-20

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
14-C195-30

14-C195-30

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
14-C195-30

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
14-C280-30

14-C280-30

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
14-C280-30

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
346-93-138-41-013000

346-93-138-41-013000

CONN SOCKET SIP 38POS GOLD

Mill-Max Manufacturing Corp.

0 -
346-93-138-41-013000

数据表

346 Bulk Active SIP 38 (1 x 38) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
346-43-138-41-013000

346-43-138-41-013000

CONN SOCKET SIP 38POS GOLD

Mill-Max Manufacturing Corp.

0 -
346-43-138-41-013000

数据表

346 Bulk Active SIP 38 (1 x 38) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
HLS-0406-T-11

HLS-0406-T-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0406-T-11

数据表

HLS Bulk Active SIP 24 (4 x 6) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
ICA-318-AGG

ICA-318-AGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-318-AGG

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
ICO-318-AGG

ICO-318-AGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-318-AGG

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
14-7350-10

14-7350-10

CONN SOCKET SIP 14POS TIN

Aries Electronics

0 -
14-7350-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 14 (1 x 14) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
14-7380-10

14-7380-10

CONN SOCKET SIP 14POS TIN

Aries Electronics

0 -
14-7380-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 14 (1 x 14) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
14-7470-10

14-7470-10

CONN SOCKET SIP 14POS TIN

Aries Electronics

0 -
14-7470-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 14 (1 x 14) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
14-7500-10

14-7500-10

CONN SOCKET SIP 14POS TIN

Aries Electronics

0 -
14-7500-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 14 (1 x 14) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
14-7750-10

14-7750-10

CONN SOCKET SIP 14POS TIN

Aries Electronics

0 -
14-7750-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 14 (1 x 14) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
24-823-90C

24-823-90C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-823-90C

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
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