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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
1735315-4

1735315-4

CONN SOCKET PGA ZIF 939POS GOLD

TE Connectivity AMP Connectors

0 -
1735315-4

数据表

- Tray Obsolete PGA, ZIF (ZIP) 939 (31 x 31) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) - Gold Thermoplastic 15.0µin (0.38µm) Copper Alloy
13-0501-20

13-0501-20

CONN SOCKET SIP 13POS TIN

Aries Electronics

0 -
13-0501-20

数据表

501 Bulk Active SIP 13 (1 x 13) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
13-0501-30

13-0501-30

CONN SOCKET SIP 13POS TIN

Aries Electronics

0 -
13-0501-30

数据表

501 Bulk Active SIP 13 (1 x 13) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
40-3513-10H

40-3513-10H

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-3513-10H

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
ICA-632-ZWGT-3

ICA-632-ZWGT-3

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-632-ZWGT-3

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
HLS-0120-G-38

HLS-0120-G-38

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0120-G-38

数据表

HLS Tube Active SIP 20 (1 x 20) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
210-47-306-41-001000

210-47-306-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
210-47-306-41-001000

数据表

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold Flash Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
117-43-448-41-005000

117-43-448-41-005000

CONN IC DIP SOCKET 48POS GOLD

Mill-Max Manufacturing Corp.

6 -
117-43-448-41-005000

数据表

117 Tube Active DIP, 0.4" (10.16mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
14-0501-21

14-0501-21

CONN SOCKET SIP 14POS GOLD

Aries Electronics

0 -
14-0501-21

数据表

501 Bulk Active SIP 14 (1 x 14) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
24-4518-01

24-4518-01

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-4518-01

数据表

518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
20-6820-90C

20-6820-90C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-6820-90C

数据表

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
20-6822-90C

20-6822-90C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-6822-90C

数据表

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
20-6823-90C

20-6823-90C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-6823-90C

数据表

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
ICO-422-ZAGG

ICO-422-ZAGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-422-ZAGG

数据表

ICO Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
ICA-322-ZAGG

ICA-322-ZAGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-322-ZAGG

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
ICA-648-ZWTT

ICA-648-ZWTT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-648-ZWTT

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyester, Glass Filled - Brass
48-6501-20

48-6501-20

CONN IC DIP SOCKET 48POS TIN

Aries Electronics

0 -
48-6501-20

数据表

501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
48-6501-30

48-6501-30

CONN IC DIP SOCKET 48POS TIN

Aries Electronics

0 -
48-6501-30

数据表

501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
14-6503-21

14-6503-21

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
14-6503-21

数据表

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
14-6503-31

14-6503-31

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
14-6503-31

数据表

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
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