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IC 插座
| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量(网格) | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 配对间距 | 端接方式 | 引脚间距 | 工作温度 | 触点表面处理 - 引脚 | 外壳材料 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 |
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1735315-4CONN SOCKET PGA ZIF 939POS GOLD |
0 | - |
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数据表 |
- | Tray | Obsolete | PGA, ZIF (ZIP) | 939 (31 x 31) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | - | Gold | Thermoplastic | 15.0µin (0.38µm) | Copper Alloy |
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13-0501-20CONN SOCKET SIP 13POS TIN |
0 | - |
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数据表 |
501 | Bulk | Active | SIP | 13 (1 x 13) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | - | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Phosphor Bronze |
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13-0501-30CONN SOCKET SIP 13POS TIN |
0 | - |
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数据表 |
501 | Bulk | Active | SIP | 13 (1 x 13) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | - | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Phosphor Bronze |
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40-3513-10HCONN IC DIP SOCKET 40POS GOLD |
0 | - |
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数据表 |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 40 (2 x 20) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
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ICA-632-ZWGT-3.100" SCREW MACHINE DIP SOCKET |
0 | - |
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数据表 |
ICA | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polyester, Glass Filled | 10.0µin (0.25µm) | Brass |
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HLS-0120-G-38.100" SCREW MACHINE SOCKET ARRAY |
0 | - |
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数据表 |
HLS | Tube | Active | SIP | 20 (1 x 20) | Gold | 30.0µin (0.76µm) | - | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 140°C | Gold | Thermoplastic | 10.0µin (0.25µm) | - |
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210-47-306-41-001000STANDRD SOLDRTL DBL SKT |
0 | - |
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数据表 |
210 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
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117-43-448-41-005000CONN IC DIP SOCKET 48POS GOLD |
6 | - |
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数据表 |
117 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 48 (2 x 24) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.070" (1.78mm) | Solder | 0.070" (1.78mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
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14-0501-21CONN SOCKET SIP 14POS GOLD |
0 | - |
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数据表 |
501 | Bulk | Active | SIP | 14 (1 x 14) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | - | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Phosphor Bronze |
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24-4518-01CONN IC DIP SOCKET 24POS GOLD |
0 | - |
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数据表 |
518 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 24 (2 x 12) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
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20-6820-90CCONN IC DIP SOCKET 20POS GOLD |
0 | - |
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数据表 |
Vertisockets™ 800 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 20 (2 x 10) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
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20-6822-90CCONN IC DIP SOCKET 20POS GOLD |
0 | - |
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数据表 |
Vertisockets™ 800 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 20 (2 x 10) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
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20-6823-90CCONN IC DIP SOCKET 20POS GOLD |
0 | - |
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数据表 |
Vertisockets™ 800 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 20 (2 x 10) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
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ICO-422-ZAGG.100" LOW PROFILE SCREW MACHINE |
0 | - |
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数据表 |
ICO | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polyester, Glass Filled | 30.0µin (0.76µm) | Brass |
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ICA-322-ZAGG.100" SCREW MACHINE DIP SOCKET |
0 | - |
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数据表 |
ICA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 22 (2 x 11) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polyester, Glass Filled | 30.0µin (0.76µm) | Brass |
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ICA-648-ZWTT.100" SCREW MACHINE DIP SOCKET |
0 | - |
|
数据表 |
ICA | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | Tin | - | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyester, Glass Filled | - | Brass |
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48-6501-20CONN IC DIP SOCKET 48POS TIN |
0 | - |
|
数据表 |
501 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Phosphor Bronze |
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48-6501-30CONN IC DIP SOCKET 48POS TIN |
0 | - |
|
数据表 |
501 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Phosphor Bronze |
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14-6503-21CONN IC DIP SOCKET 14POS GOLD |
0 | - |
|
数据表 |
503 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 14 (2 x 7) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Phosphor Bronze |
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14-6503-31CONN IC DIP SOCKET 14POS GOLD |
0 | - |
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数据表 |
503 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 14 (2 x 7) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Phosphor Bronze |
