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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
09-0501-21

09-0501-21

CONN SOCKET SIP 9POS GOLD

Aries Electronics

0 -
09-0501-21

数据表

501 Bulk Active SIP 9 (1 x 9) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
09-0501-31

09-0501-31

CONN SOCKET SIP 9POS GOLD

Aries Electronics

0 -
09-0501-31

数据表

501 Bulk Active SIP 9 (1 x 9) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
10-2503-21

10-2503-21

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

0 -
10-2503-21

数据表

503 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
10-2503-31

10-2503-31

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

0 -
10-2503-31

数据表

503 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
32-9513-10H

32-9513-10H

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

0 -
32-9513-10H

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
ICF-624-STL-I

ICF-624-STL-I

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-624-STL-I

数据表

ICF Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Tin - Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
ICF-624-STL-O

ICF-624-STL-O

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-624-STL-O

数据表

ICF Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Tin - Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
APH-1820-T-T

APH-1820-T-T

APH-1820-T-T

Samtec Inc.

0 -
APH-1820-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1420-T-T

APH-1420-T-T

APH-1420-T-T

Samtec Inc.

0 -
APH-1420-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0520-T-T

APH-0520-T-T

APH-0520-T-T

Samtec Inc.

0 -
APH-0520-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0620-T-T

APH-0620-T-T

APH-0620-T-T

Samtec Inc.

0 -
APH-0620-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1620-T-T

APH-1620-T-T

APH-1620-T-T

Samtec Inc.

0 -
APH-1620-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0320-T-T

APH-0320-T-T

APH-0320-T-T

Samtec Inc.

0 -
APH-0320-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0820-T-T

APH-0820-T-T

APH-0820-T-T

Samtec Inc.

0 -
APH-0820-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1220-T-T

APH-1220-T-T

APH-1220-T-T

Samtec Inc.

0 -
APH-1220-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0420-T-T

APH-0420-T-T

APH-0420-T-T

Samtec Inc.

0 -
APH-0420-T-T

数据表

* - Active - - - - - - - - - - - - - - -
110-99-304-61-001000

110-99-304-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-99-304-61-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
40-516-10

40-516-10

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

0 -
40-516-10

数据表

516 Bulk Obsolete DIP, ZIF (ZIP) 40 (2 x 20) Tin 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Beryllium Copper
510-83-184-15-001101

510-83-184-15-001101

CONN SOCKET PGA 184POS GOLD

Preci-Dip

0 -
510-83-184-15-001101

数据表

510 Bulk Active PGA 184 (15 x 15) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
510-83-184-17-081101

510-83-184-17-081101

CONN SOCKET PGA 184POS GOLD

Preci-Dip

0 -
510-83-184-17-081101

数据表

510 Bulk Active PGA 184 (17 x 17) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
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