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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
16-3508-301

16-3508-301

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
16-3508-301

数据表

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
14-822-90

14-822-90

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
14-822-90

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Phosphor Bronze
510-87-300-21-001101

510-87-300-21-001101

CONN SOCKET PGA 300POS GOLD

Preci-Dip

0 -
510-87-300-21-001101

数据表

510 Bulk Active PGA 300 (21 x 21) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
ICF-318-STL-I

ICF-318-STL-I

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-318-STL-I

数据表

ICF Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Tin - Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
ICF-640-TL-I-TR

ICF-640-TL-I-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-640-TL-I-TR

数据表

ICF Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Tin - Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
ICA-422-AGT

ICA-422-AGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-422-AGT

数据表

ICA Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
28-3513-10H

28-3513-10H

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
28-3513-10H

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
HLS-0505-T-10

HLS-0505-T-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0505-T-10

数据表

HLS Bulk Active SIP 25 (5 x 5) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
APH-0506-G-H

APH-0506-G-H

APH-0506-G-H

Samtec Inc.

0 -
APH-0506-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1906-G-H

APH-1906-G-H

APH-1906-G-H

Samtec Inc.

0 -
APH-1906-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0206-G-H

APH-0206-G-H

APH-0206-G-H

Samtec Inc.

0 -
APH-0206-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0306-G-H

APH-0306-G-H

APH-0306-G-H

Samtec Inc.

0 -
APH-0306-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0806-G-H

APH-0806-G-H

APH-0806-G-H

Samtec Inc.

0 -
APH-0806-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1306-G-H

APH-1306-G-H

APH-1306-G-H

Samtec Inc.

0 -
APH-1306-G-H

数据表

* - Active - - - - - - - - - - - - - - -
268-5401-50-1102JH

268-5401-50-1102JH

CONN SOCKET CLCC 68POS GOLD

3M

0 -
268-5401-50-1102JH

数据表

OEM Bulk Obsolete CLCC 68 (4 x 17) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyphenylene Sulfide (PPS), Glass Filled 30.0µin (0.76µm) Beryllium Copper
HLS-0120-G-31

HLS-0120-G-31

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0120-G-31

数据表

HLS Tube Active SIP 20 (1 x 20) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
APA-324-T-B

APA-324-T-B

ADAPTER PLUG

Samtec Inc.

0 -
APA-324-T-B

数据表

APA Bulk Active - 24 (2 x 12) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
APO-624-T-B

APO-624-T-B

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-624-T-B

数据表

APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
06-0511-11

06-0511-11

CONN SOCKET SIP 6POS GOLD

Aries Electronics

0 -
06-0511-11

数据表

511 Bulk Active SIP 6 (1 x 6) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
116-83-636-41-013101

116-83-636-41-013101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

0 -
116-83-636-41-013101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
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