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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
317-47-108-41-005000

317-47-108-41-005000

CONN SOCKET SIP 8POS GOLD

Mill-Max Manufacturing Corp.

470 -
317-47-108-41-005000

数据表

317 Tube Active SIP 8 (1 x 8) Gold Flash Beryllium Copper Through Hole - 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
ICF-308-T-O

ICF-308-T-O

CONN IC DIP SOCKET 8POS TIN

Samtec Inc.

16 -
ICF-308-T-O

数据表

ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Tin - Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
XR2A-0815

XR2A-0815

CONN IC DIP SOCKET 8POS GOLD

Omron Electronics Inc-EMC Div

118 -
XR2A-0815

数据表

XR2 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polybutylene Terephthalate (PBT), Glass Filled 10.0µin (0.25µm) Brass
110-47-422-41-001000

110-47-422-41-001000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

225 -
110-47-422-41-001000

数据表

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
AR 14-HZL/07-TT

AR 14-HZL/07-TT

CONN IC DIP SOCKET 14POS GOLD

Assmann WSW Components

2,942 -
AR 14-HZL/07-TT

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester 200.0µin (5.08µm) Beryllium Copper
115-47-318-41-001000

115-47-318-41-001000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

440 -
115-47-318-41-001000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
210-1-28-006

210-1-28-006

CONN IC DIP SOCKET 28POS GOLD

CNC Tech

1,264 -
210-1-28-006

数据表

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT) 200.0µin (5.08µm) Brass
214-99-314-01-670800

214-99-314-01-670800

CONN IC DIP SOCKET 14POS TINLEAD

Mill-Max Manufacturing Corp.

356 -
214-99-314-01-670800

数据表

214 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
210-93-314-41-001000

210-93-314-41-001000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

282 -
210-93-314-41-001000

数据表

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
940-44-020-24-000000

940-44-020-24-000000

CONN SOCKET PLCC 20POS TIN

Mill-Max Manufacturing Corp.

105 -
940-44-020-24-000000

数据表

940 Tube Active PLCC 20 (4 x 5) Tin 150.0µin (3.81µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-47-314-41-006000

116-47-314-41-006000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

570 -
116-47-314-41-006000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-47-624-41-001000

115-47-624-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

345 -
115-47-624-41-001000

数据表

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
210-47-628-41-001000

210-47-628-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

308 -
210-47-628-41-001000

数据表

210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold Flash Beryllium Copper Surface Mount Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-93-314-41-001000

115-93-314-41-001000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

332 -
115-93-314-41-001000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
10-2513-10

10-2513-10

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

338 -
10-2513-10

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
317-47-116-41-005000

317-47-116-41-005000

CONN SOCKET SIP 16POS GOLD

Mill-Max Manufacturing Corp.

190 -
317-47-116-41-005000

数据表

317 Tube Active SIP 16 (1 x 16) Gold Flash Beryllium Copper Through Hole - 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
214-99-318-01-670800

214-99-318-01-670800

CONN IC DIP SOCKET 18POS TINLEAD

Mill-Max Manufacturing Corp.

390 -
214-99-318-01-670800

数据表

214 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
214-44-318-01-670800

214-44-318-01-670800

CONN IC DIP SOCKET 18POS TIN

Mill-Max Manufacturing Corp.

362 -
214-44-318-01-670800

数据表

214 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Tin 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
214-99-320-01-670800

214-99-320-01-670800

CONN IC DIP SOCKET 20POS TINLEAD

Mill-Max Manufacturing Corp.

789 -
214-99-320-01-670800

数据表

214 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-47-628-41-605000

110-47-628-41-605000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

242 -
110-47-628-41-605000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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