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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
16-C280-10

16-C280-10

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

193 -
16-C280-10

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
4516

4516

CONN TRANSIST TO-3 3POS TIN

Keystone Electronics

770 -
4516

数据表

- Bulk Active Transistor, TO-3 3 (Oval) Tin - Brass Chassis Mount Closed Frame - Solder - - Tin Polybutylene Terephthalate (PBT) - Brass
ICF-328-T-O-TR

ICF-328-T-O-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

350 -
ICF-328-T-O-TR

数据表

ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Tin - Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
ICA-628-SGT

ICA-628-SGT

CONN IC DIP SOCKET 28POS GOLD

Samtec Inc.

221 -
ICA-628-SGT

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
ICA-632-SST

ICA-632-SST

CONN IC DIP SOCKET 32POS GOLD

Samtec Inc.

526 -
ICA-632-SST

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
540-44-020-17-400000

540-44-020-17-400000

CONN SOCKET PLCC 20POS TIN

Mill-Max Manufacturing Corp.

359 -
540-44-020-17-400000

数据表

540 Tube Active PLCC 20 (4 x 5) Tin 150.0µin (3.81µm) Copper Alloy Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyphenylene Sulfide (PPS) 150.0µin (3.81µm) Copper Alloy
4514

4514

CONN TRANSIST TO-3 3POS TIN

Keystone Electronics

1,012 -
4514

数据表

- Bulk Active Transistor, TO-3 3 (Oval) Tin - Brass Chassis Mount Closed Frame - Solder - - Tin Polybutylene Terephthalate (PBT) - Brass
614-43-316-31-012000

614-43-316-31-012000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

315 -
614-43-316-31-012000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
4515

4515

CONN TRANSIST TO-3 3POS TIN

Keystone Electronics

1,028 -
4515

数据表

- Bulk Active Transistor, TO-3 3 (Oval) Tin - Brass Chassis Mount Closed Frame - Solder - - Tin Polybutylene Terephthalate (PBT) - Brass
ICA-640-STT

ICA-640-STT

CONN IC DIP SOCKET 40POS TIN

Samtec Inc.

127 -
ICA-640-STT

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyester, Glass Filled - Brass
117-47-642-41-005000

117-47-642-41-005000

CONN IC DIP SOCKET 42POS GOLD

Mill-Max Manufacturing Corp.

133 -
117-47-642-41-005000

数据表

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold Flash Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-93-318-31-012000

614-93-318-31-012000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

121 -
614-93-318-31-012000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
ICO-316-NGT

ICO-316-NGT

100" LOW PROFILE SCREW MACHINE D

Samtec Inc.

175 -
ICO-316-NGT

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
299-43-310-10-001000

299-43-310-10-001000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

126 -
299-43-310-10-001000

数据表

299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
123-93-318-41-001000

123-93-318-41-001000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

113 -
123-93-318-41-001000

数据表

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-93-648-41-001000

110-93-648-41-001000

CONN IC DIP SOCKET 48POS GOLD

Mill-Max Manufacturing Corp.

128 -
110-93-648-41-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-93-640-41-003000

115-93-640-41-003000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

108 -
115-93-640-41-003000

数据表

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
ICA-316-ZAGT

ICA-316-ZAGT

CONN IC DIP SOCKET 16POS GOLD

Samtec Inc.

190 -
ICA-316-ZAGT

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
110-93-314-41-801000

110-93-314-41-801000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

130 -
110-93-314-41-801000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
299-93-312-11-001000

299-93-312-11-001000

CONN IC DIP SOCKET 12POS GOLD

Mill-Max Manufacturing Corp.

138 -
299-93-312-11-001000

数据表

299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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