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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
917-93-210-41-005000

917-93-210-41-005000

CONN SOCKET TRANSIST TO100 10POS

Mill-Max Manufacturing Corp.

102 -
917-93-210-41-005000

数据表

917 Tube Active Transistor, TO-100 10 (Round) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame - Solder - -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-93-624-41-003000

115-93-624-41-003000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

318 -
115-93-624-41-003000

数据表

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-43-324-41-003000

115-43-324-41-003000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

192 -
115-43-324-41-003000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-93-324-41-003000

115-93-324-41-003000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

133 -
115-93-324-41-003000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-43-624-41-003000

115-43-624-41-003000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

122 -
115-43-624-41-003000

数据表

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
ICF-308-S-O-TR

ICF-308-S-O-TR

CONN IC DIP SOCKET 8POS TIN

Samtec Inc.

454 -
ICF-308-S-O-TR

数据表

ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
940-44-068-17-400000

940-44-068-17-400000

CONN SOCKET PLCC 68POS TIN

Mill-Max Manufacturing Corp.

648 -
940-44-068-17-400000

数据表

940 Tube Active PLCC 68 (4 x 17) Tin 150.0µin (3.81µm) Beryllium Copper Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
214-44-632-01-670800

214-44-632-01-670800

CONN IC DIP SOCKET 32POS TIN

Mill-Max Manufacturing Corp.

805 -
214-44-632-01-670800

数据表

214 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Tin 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-87-628-41-105101

110-87-628-41-105101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

157 -
110-87-628-41-105101

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
ICO-316-SGT

ICO-316-SGT

CONN IC DIP SOCKET 16POS GOLD

Samtec Inc.

123 -
ICO-316-SGT

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
ICA-632-STT

ICA-632-STT

CONN IC DIP SOCKET 32POS TIN

Samtec Inc.

0 -
ICA-632-STT

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyester, Glass Filled - Brass
299-87-312-11-001101

299-87-312-11-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

1,568 -
299-87-312-11-001101

数据表

299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-87-640-41-001151

110-87-640-41-001151

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

192 -
110-87-640-41-001151

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold Flash Beryllium Copper Through Hole Open Frame, No Center Bar 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
ICA-628-SST

ICA-628-SST

CONN IC DIP SOCKET 28POS GOLD

Samtec Inc.

661 -
ICA-628-SST

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
12-0511-10

12-0511-10

CONN SOCKET SIP 12POS TIN

Aries Electronics

182 -
12-0511-10

数据表

511 Bulk Active SIP 12 (1 x 12) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 50.0µin (1.27µm) Phosphor Bronze
115-43-328-41-003000

115-43-328-41-003000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

181 -
115-43-328-41-003000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
ICO-628-NTT

ICO-628-NTT

100" LOW PROFILE SCREW MACHINE D

Samtec Inc.

563 -
ICO-628-NTT

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyester, Glass Filled - Brass
115-43-628-41-003000

115-43-628-41-003000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

168 -
115-43-628-41-003000

数据表

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-93-328-41-003000

115-93-328-41-003000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

138 -
115-93-328-41-003000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-43-314-31-012000

614-43-314-31-012000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

152 -
614-43-314-31-012000

数据表

614 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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