富聪科技订单满¥1000免运费
关注我们:

IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

全部重置
全部应用
结果
图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APH-1526-G-H

APH-1526-G-H

APH-1526-G-H

Samtec Inc.

0 -
APH-1526-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0826-G-H

APH-0826-G-H

APH-0826-G-H

Samtec Inc.

0 -
APH-0826-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1826-G-H

APH-1826-G-H

APH-1826-G-H

Samtec Inc.

0 -
APH-1826-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1326-G-H

APH-1326-G-H

APH-1326-G-H

Samtec Inc.

0 -
APH-1326-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1226-G-H

APH-1226-G-H

APH-1226-G-H

Samtec Inc.

0 -
APH-1226-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0226-G-H

APH-0226-G-H

APH-0226-G-H

Samtec Inc.

0 -
APH-0226-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0326-G-H

APH-0326-G-H

APH-0326-G-H

Samtec Inc.

0 -
APH-0326-G-H

数据表

* - Active - - - - - - - - - - - - - - -
517-83-419-19-111111

517-83-419-19-111111

CONN SOCKET PGA 419POS GOLD

Preci-Dip

0 -
517-83-419-19-111111

数据表

517 Bulk Active PGA 419 (19 x 19) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
48-6556-31

48-6556-31

UNIV TEST SOCKET RECEPT 6556

Aries Electronics

0 -
48-6556-31

数据表

6556 - Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) 150°C Gold Polyphenylene Sulfide (PPS), Glass Filled 10.0µin (0.25µm) Brass
24-6556-40

24-6556-40

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-6556-40

数据表

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder Cup 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Brass
510-91-153-15-061001

510-91-153-15-061001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

0 -
510-91-153-15-061001

数据表

510 Bulk Active PGA 153 (15 x 15) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
24-3573-16

24-3573-16

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

0 -
24-3573-16

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Nickel Boron Polyphenylene Sulfide (PPS), Glass Filled 50.0µin (1.27µm) Beryllium Nickel
116-87-328-41-008101

116-87-328-41-008101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
116-87-328-41-008101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
514-87-292M20-001148

514-87-292M20-001148

CONN SOCKET BGA 292POS GOLD

Preci-Dip

0 -
514-87-292M20-001148

数据表

514 Bulk Active BGA 292 (20 x 20) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
1871554-1

1871554-1

CONN SKT 1207-F RIGHT LEVER SMD

TE Connectivity AMP Connectors

5 -
1871554-1

数据表

- Bulk Obsolete LGA 1207 (33 x 34) Gold - Copper Alloy Surface Mount Closed Frame 0.043" (1.09mm) Solder 0.043" (1.09mm) - Gold Thermoplastic - Copper Alloy
116-83-424-41-012101

116-83-424-41-012101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
116-83-424-41-012101

数据表

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
APH-1832-G-R

APH-1832-G-R

APH-1832-G-R

Samtec Inc.

0 -
APH-1832-G-R

数据表

* - Active - - - - - - - - - - - - - - -
115-87-652-41-001101

115-87-652-41-001101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

0 -
115-87-652-41-001101

数据表

115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
APH-0432-G-R

APH-0432-G-R

APH-0432-G-R

Samtec Inc.

0 -
APH-0432-G-R

数据表

* - Active - - - - - - - - - - - - - - -
115-83-636-41-003101

115-83-636-41-003101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

0 -
115-83-636-41-003101

数据表

115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
富聪科技

搜索

富聪科技

产品

富聪科技

电话

富聪科技

用户