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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
115-43-308-41-001000

115-43-308-41-001000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

115 -
115-43-308-41-001000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
210-1-20-003

210-1-20-003

CONN IC DIP SOCKET 20POS GOLD

CNC Tech

690 -
210-1-20-003

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT) 200.0µin (5.08µm) Brass
115-93-308-41-001000

115-93-308-41-001000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

214 -
115-93-308-41-001000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-47-318-41-001000

110-47-318-41-001000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

339 -
110-47-318-41-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-99-624-41-001000

110-99-624-41-001000

CONN IC DIP SOCKET 24POS TINLEAD

Mill-Max Manufacturing Corp.

365 -
110-99-624-41-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-87-210-41-006101

116-87-210-41-006101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

1,275 -
116-87-210-41-006101

数据表

116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
111-43-308-41-001000

111-43-308-41-001000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

445 -
111-43-308-41-001000

数据表

111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
69802-044LF

69802-044LF

CONN SOCKET PLCC 44POS TIN

Amphenol ICC (FCI)

4,288 -
69802-044LF

数据表

- Tube Active PLCC 44 (4 x 11) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 125°C Tin Polyphenylene Sulfide (PPS) 150.0µin (3.81µm) Phosphor Bronze
115-47-316-41-001000

115-47-316-41-001000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

374 -
115-47-316-41-001000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
A-CCS 020-Z-T

A-CCS 020-Z-T

IC SOCKET PLCC 20POS TIN

Assmann WSW Components

558 -
A-CCS 020-Z-T

数据表

- Tube Active PLCC 20 (4 x 5) Tin 160.0µin (4.06µm) Phosphor Bronze Through Hole Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT) 160.0µin (4.06µm) Phosphor Bronze
110-99-324-41-001000

110-99-324-41-001000

CONN IC DIP SOCKET 24POS TINLEAD

Mill-Max Manufacturing Corp.

445 -
110-99-324-41-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
ICA-318-STT

ICA-318-STT

CONN IC DIP SOCKET 18POS TIN

Samtec Inc.

821 -
ICA-318-STT

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyester, Glass Filled - Brass
A-CCS 028-G-T

A-CCS 028-G-T

CONN SOCKET PLCC 28POS GOLD

Assmann WSW Components

5,766 -
A-CCS 028-G-T

数据表

- Tube Active PLCC 28 (4 x 7) Gold - Phosphor Bronze Through Hole Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Gold Polybutylene Terephthalate (PBT) - Phosphor Bronze
69802-144LF

69802-144LF

CONN SOCKET PLCC 44POS TIN

Amphenol ICC (FCI)

13,720 -
69802-144LF

数据表

- Tube Active PLCC 44 (4 x 11) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 125°C Tin Polyphenylene Sulfide (PPS) 150.0µin (3.81µm) Phosphor Bronze
16-3518-10T

16-3518-10T

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

434 -
16-3518-10T

数据表

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
ICA-308-SST

ICA-308-SST

CONN IC DIP SOCKET 8POS GOLD

Samtec Inc.

101 -
ICA-308-SST

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled - Brass
ICO-314-SGT

ICO-314-SGT

CONN IC DIP SKT 14POS

Samtec Inc.

1,428 -
ICO-314-SGT

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
111-43-314-41-001000

111-43-314-41-001000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

6,630 -
111-43-314-41-001000

数据表

111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
24-3518-10

24-3518-10

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

274 -
24-3518-10

数据表

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
AW 127-06/G-T

AW 127-06/G-T

SOCKET, MACHINED CONTACTS, 1 ROW

Assmann WSW Components

867 -
AW 127-06/G-T

数据表

- Bag Active - - Gold Flash - Through Hole - 0.100" (2.54mm) Solder - -40°C ~ 105°C Gold - Flash -
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