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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
1-2324271-1

1-2324271-1

RIGHT SEGMEN LGA4189-4 SOCKET-P4

TE Connectivity AMP Connectors

215 -
1-2324271-1

数据表

- Tray Active LGA 4189 2092 Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame 0.039" (1.00mm) Solder 0.034" (0.86mm) -25°C ~ 100°C Gold Thermoplastic 30.0µin (0.76µm) Copper Alloy
240-1288-00-0602J

240-1288-00-0602J

CONN IC DIP SOCKET ZIF 40POS GLD

3M

40 -
240-1288-00-0602J

数据表

Textool™ Tube Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Gold Polysulfone (PSU), Glass Filled 30.0µin (0.76µm) Beryllium Copper
243-18-1-03

243-18-1-03

CONN IC DIP SOCKET 18POS TIN

CNC Tech

2,108 -
243-18-1-03

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 60.0µin (1.52µm) Phosphor Bronze
243-24-1-06

243-24-1-06

CONN IC DIP SOCKET 24POS TIN

CNC Tech

2,043 -
243-24-1-06

数据表

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Tin 100.0µin (2.54µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 100.0µin (2.54µm) Phosphor Bronze
DILB24P-224TLF

DILB24P-224TLF

CONN IC DIP SOCKET 24POS TINLEAD

Amphenol ICC (FCI)

10,133 -
DILB24P-224TLF

数据表

DILB Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Tin-Lead 100.0µin (2.54µm) Copper Alloy Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polyamide (PA), Nylon 100.0µin (2.54µm) Copper Alloy
243-32-1-06

243-32-1-06

CONN IC DIP SOCKET 32POS TIN

CNC Tech

1,109 -
243-32-1-06

数据表

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Tin 100.0µin (2.54µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 100.0µin (2.54µm) Phosphor Bronze
114-87-308-41-117101

114-87-308-41-117101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

7,117 -
114-87-308-41-117101

数据表

114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
ICA-308-STT

ICA-308-STT

CONN IC DIP SOCKET 8POS TIN

Samtec Inc.

3,085 -
ICA-308-STT

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyester, Glass Filled - Brass
232-32-TR

232-32-TR

CONN SOCKET PLCC 32POS TIN

CNC Tech

4,228 -
232-32-TR

数据表

- Tape & Reel (TR) Active PLCC 32 (4 x 8) Tin 100.0µin (2.54µm) Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 105°C Tin Polyphenylene Sulfide (PPS), Glass Filled 100.0µin (2.54µm) Phosphor Bronze
4832-6004-CP

4832-6004-CP

CONN IC DIP SOCKET 32POS TIN

3M

810 -
4832-6004-CP

数据表

4800 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -25°C ~ 85°C Tin Polyester, Glass Filled 35.0µin (0.90µm) Phosphor Bronze
210-1-14-003

210-1-14-003

CONN IC DIP SOCKET 14POS GOLD

CNC Tech

532 -
210-1-14-003

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT) 200.0µin (5.08µm) Brass
SA243000

SA243000

CONN IC DIP SOCKET 24POS GOLD

On Shore Technology Inc.

351 -
SA243000

数据表

SA Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester, Glass Filled 200.0µin (5.08µm) Brass
210-1-16-003

210-1-16-003

CONN IC DIP SOCKET 16POS GOLD

CNC Tech

298 -
210-1-16-003

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT) 200.0µin (5.08µm) Brass
110-47-308-41-105000

110-47-308-41-105000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

287 -
110-47-308-41-105000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
07-0513-10

07-0513-10

CONN SOCKET SIP 7POS GOLD

Aries Electronics

797 -
07-0513-10

数据表

0513 Bulk Active SIP 7 (1 x 7) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
69802-032LF

69802-032LF

CONN SOCKET PLCC 32POS TIN

Amphenol ICC (FCI)

1,534 -
69802-032LF

数据表

- Tube Active PLCC 32 (2 x 7, 2 x 9) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 125°C Tin Polyphenylene Sulfide (PPS) 150.0µin (3.81µm) Phosphor Bronze
ICO-308-SGT

ICO-308-SGT

CONN IC DIP SOCKET 8POS GOLD

Samtec Inc.

721 -
ICO-308-SGT

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
114-87-316-41-134161

114-87-316-41-134161

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

200 -
114-87-316-41-134161

数据表

114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
232-44-TR

232-44-TR

CONN SOCKET PLCC 44POS TIN

CNC Tech

392 -
232-44-TR

数据表

- Tape & Reel (TR) Active PLCC 44 (4 x 11) Tin 100.0µin (2.54µm) Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 105°C Tin Polyphenylene Sulfide (PPS), Glass Filled 100.0µin (2.54µm) Phosphor Bronze
115-47-314-41-001000

115-47-314-41-001000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

235 -
115-47-314-41-001000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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