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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
210-43-632-41-001000

210-43-632-41-001000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

204 -
210-43-632-41-001000

数据表

210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-41-640-41-001000

110-41-640-41-001000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

432 -
110-41-640-41-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-93-328-41-001000

115-93-328-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

339 -
115-93-328-41-001000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
123-93-314-41-001000

123-93-314-41-001000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

181 -
123-93-314-41-001000

数据表

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
D2840-42

D2840-42

CONN IC DIP SOCKET 40POS GOLD

Harwin Inc.

318 -
D2840-42

数据表

D2 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Plastic 196.9µin (5.00µm) Brass
4513

4513

CONN TRANSIST TO-3 3POS TIN

Keystone Electronics

2,238 -
4513

数据表

- Bulk Active Transistor, TO-3 3 (Oval) Tin - Brass Chassis Mount Closed Frame - Solder - - Tin Polybutylene Terephthalate (PBT) - Brass
940-44-084-17-400000

940-44-084-17-400000

CONN SOCKET PLCC 84POS TIN

Mill-Max Manufacturing Corp.

212 -
940-44-084-17-400000

数据表

940 Tube Active PLCC 84 (4 x 21) Tin 150.0µin (3.81µm) Beryllium Copper Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-13-324-41-001000

110-13-324-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

1,275 -
110-13-324-41-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
110-43-640-41-001000

110-43-640-41-001000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

579 -
110-43-640-41-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
210-43-640-41-001000

210-43-640-41-001000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

265 -
210-43-640-41-001000

数据表

210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
299-93-310-11-001000

299-93-310-11-001000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

213 -
299-93-310-11-001000

数据表

299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
299-43-310-11-001000

299-43-310-11-001000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

248 -
299-43-310-11-001000

数据表

299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
D01-9952042

D01-9952042

CONN SOCKET SIP 20POS GOLD

Harwin Inc.

357 -
D01-9952042

数据表

D01-995 Bulk Active SIP 20 (1 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 196.9µin (5.00µm) Brass
20-0511-10

20-0511-10

CONN SOCKET SIP 20POS TIN

Aries Electronics

2,704 -
20-0511-10

数据表

511 Bulk Active SIP 20 (1 x 20) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 50.0µin (1.27µm) Phosphor Bronze
110-13-328-41-001000

110-13-328-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

212 -
110-13-328-41-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
540-44-044-17-400000

540-44-044-17-400000

CONN SOCKET PLCC 44POS TIN

Mill-Max Manufacturing Corp.

687 -
540-44-044-17-400000

数据表

540 Tube Active PLCC 44 (4 x 11) Tin 150.0µin (3.81µm) Copper Alloy Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 125°C Tin Polyphenylene Sulfide (PPS) 150.0µin (3.81µm) Copper Alloy
110-44-964-41-001000

110-44-964-41-001000

CONN IC DIP SOCKET 64POS TIN

Mill-Max Manufacturing Corp.

154 -
110-44-964-41-001000

数据表

110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
299-93-310-10-001000

299-93-310-10-001000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

114 -
299-93-310-10-001000

数据表

299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
123-93-320-41-001000

123-93-320-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

199 -
123-93-320-41-001000

数据表

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
299-43-312-11-001000

299-43-312-11-001000

CONN IC DIP SOCKET 12POS GOLD

Mill-Max Manufacturing Corp.

180 -
299-43-312-11-001000

数据表

299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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