富聪科技订单满¥1000免运费
关注我们:

IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

全部重置
全部应用
结果
图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
117-87-764-41-005101

117-87-764-41-005101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip

443 -
117-87-764-41-005101

数据表

117 Tube Active DIP, 0.75" (19.05mm) Row Spacing 64 (2 x 32) Gold Flash Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-13-640-41-001000

110-13-640-41-001000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

148 -
110-13-640-41-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
25-0511-10

25-0511-10

CONN SOCKET SIP 25POS TIN

Aries Electronics

379 -
25-0511-10

数据表

511 Tube Active SIP 25 (1 x 25) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 50.0µin (1.27µm) Phosphor Bronze
299-93-314-10-001000

299-93-314-10-001000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

152 -
299-93-314-10-001000

数据表

299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
10-2820-90C

10-2820-90C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

368 -
10-2820-90C

数据表

Vertisockets™ 800 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
14-820-90T

14-820-90T

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

264 -
14-820-90T

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Phosphor Bronze
299-43-610-10-002000

299-43-610-10-002000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

165 -
299-43-610-10-002000

数据表

299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-43-964-41-001000

110-43-964-41-001000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.

103 -
110-43-964-41-001000

数据表

110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
10-2810-90

10-2810-90

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

500 -
10-2810-90

数据表

Vertisockets™ 800 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Phosphor Bronze
14-810-90

14-810-90

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

573 -
14-810-90

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Phosphor Bronze
299-43-320-10-001000

299-43-320-10-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

173 -
299-43-320-10-001000

数据表

299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
2041549-1

2041549-1

SOCKET ASSY, DMD 350, T/R, G/F

TE Connectivity AMP Connectors

442 -
2041549-1

数据表

DMD Tape & Reel (TR) Active PGA, ZIF (ZIP) 350 (35 x 36) Gold Flash Copper Alloy Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 105°C Tin-Lead Liquid Crystal Polymer (LCP), Glass Filled - Copper Alloy
28-526-10

28-526-10

CONN IC DIP SOCKET ZIF 28POS TIN

Aries Electronics

200 -
28-526-10

数据表

Lo-PRO®file, 526 Bulk Active DIP, ZIF (ZIP) 28 (2 x 14) Tin 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Beryllium Copper
TCC05DCSN-S1403

TCC05DCSN-S1403

CONN TRANSIST TO-220/TO-247 5POS

Sullins Connector Solutions

102 -
TCC05DCSN-S1403

数据表

- Tray Active Transistor, TO-220 and TO-247 5 (Rectangular) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - - Solder - -65°C ~ 175°C Gold Polyphenylene Sulfide (PPS) 30.0µin (0.76µm) Beryllium Copper
110-43-308-41-105000

110-43-308-41-105000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

119 -
110-43-308-41-105000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
32-6554-10

32-6554-10

CONN IC DIP SOCKET ZIF 32POS TIN

Aries Electronics

216 -
32-6554-10

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
32-6554-11

32-6554-11

CONN IC DIP SOCKET ZIF 32POS GLD

Aries Electronics

165 -
32-6554-11

数据表

55 Tube Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled - Beryllium Copper
1-2324271-3

1-2324271-3

RIGHT SEGMEN LGA4189-4 SOCKET-P4

TE Connectivity AMP Connectors

4,159 -
1-2324271-3

数据表

- Tray Active LGA 4189 2092 Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame 0.039" (1.00mm) Solder 0.034" (0.86mm) -25°C ~ 100°C Gold Thermoplastic 15.0µin (0.38µm) Copper Alloy
714-43-264-31-018000

714-43-264-31-018000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.

129 -
714-43-264-31-018000

数据表

714 Tube Active DIP, 0.1" (2.54mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 30.0µin (0.76µm) Brass Alloy
1-2324271-2

1-2324271-2

LEFT SEGMEN LGA4189-4 SOCKET-P4

TE Connectivity AMP Connectors

3,756 -
1-2324271-2

数据表

- Tray Active LGA 4189 2092 Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame 0.039" (1.00mm) Solder 0.034" (0.86mm) -25°C ~ 100°C Gold Thermoplastic 30.0µin (0.76µm) Copper Alloy
共 19086 条记录«上一页1... 1617181920212223...955下一页»
富聪科技

搜索

富聪科技

产品

富聪科技

电话

富聪科技

用户