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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
110-41-320-41-001000

110-41-320-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

525 -
110-41-320-41-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-93-318-41-003000

115-93-318-41-003000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

2,514 -
115-93-318-41-003000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
8452-21B1-RK-TP

8452-21B1-RK-TP

CONN SOCKET PLCC 52POS TIN

3M

1,883 -
8452-21B1-RK-TP

数据表

8400 Tube Active PLCC 52 (4 x 13) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 160.0µin (4.06µm) Copper Alloy
4606

4606

CONN TRANSIST TO-3 3POS TIN

Keystone Electronics

888 -
4606

数据表

- Bulk Active Transistor, TO-3 3 (Rectangular) Tin - Brass Chassis Mount Closed Frame - Solder - - Tin Polyester, Glass Filled - Brass
114-87-328-41-134161

114-87-328-41-134161

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

2,271 -
114-87-328-41-134161

数据表

114 Box Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
A-CCS 084-Z-T

A-CCS 084-Z-T

IC PLCC SOCKET 84POS TIN

Assmann WSW Components

649 -
A-CCS 084-Z-T

数据表

- Tube Active PLCC 84 (4 x 21) Tin 160.0µin (4.06µm) Phosphor Bronze Through Hole Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT) 160.0µin (4.06µm) Phosphor Bronze
123-87-316-41-001101

123-87-316-41-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

555 -
123-87-316-41-001101

数据表

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
54020-44030LF

54020-44030LF

CONN SOCKET PLCC 44POS TIN

Amphenol ICC (FCI)

1,612 -
54020-44030LF

数据表

- Tube Active PLCC 44 (4 x 11) Tin 100.0µin (2.54µm) Copper Alloy Through Hole Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polyphenylene Sulfide (PPS) 100.0µin (2.54µm) Copper Alloy
917-43-104-41-001000

917-43-104-41-001000

CONN TRANSIST TO-5 4POS GOLD

Mill-Max Manufacturing Corp.

340 -
917-43-104-41-001000

数据表

917 Tube Active Transistor, TO-5 4 (Round) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Closed Frame - Solder - -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
AR 20-HZW/TN

AR 20-HZW/TN

CONN IC DIP SOCKET 20POS GOLD

Assmann WSW Components

1,862 -
AR 20-HZW/TN

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester 200.0µin (5.08µm) Beryllium Copper
110-87-632-41-001101

110-87-632-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

1,879 -
110-87-632-41-001101

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
SA486040

SA486040

CONN IC DIP SOCKET 48POS GOLD

On Shore Technology Inc.

106 -
SA486040

数据表

SA Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester, Glass Filled 80.0µin (2.03µm) Brass
110-93-318-41-001000

110-93-318-41-001000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

559 -
110-93-318-41-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-43-318-41-001000

110-43-318-41-001000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

291 -
110-43-318-41-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
4600

4600

CONN TRANSIST TO-3 3POS TIN

Keystone Electronics

596 -
4600

数据表

- Bulk Active Transistor, TO-3 3 (Oval) Tin - Brass Chassis Mount Closed Frame - Solder - - Tin Polyester, Glass Filled - Brass
110-93-320-41-001000

110-93-320-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

833 -
110-93-320-41-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-43-314-10-001000

110-43-314-10-001000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

209 -
110-43-314-10-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7), 4 Loaded Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
214-44-320-01-670800

214-44-320-01-670800

CONN IC DIP SOCKET 20POS TIN

Mill-Max Manufacturing Corp.

324 -
214-44-320-01-670800

数据表

214 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Tin 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
8468-21B1-RK-TP

8468-21B1-RK-TP

CONN SOCKET PLCC 68POS TIN

3M

2,073 -
8468-21B1-RK-TP

数据表

8400 Tube Active PLCC 68 (4 x 17) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 160.0µin (4.06µm) Copper Alloy
8468-21A1-RK-TP

8468-21A1-RK-TP

CONN SOCKET PLCC 68POS TIN

3M

713 -
8468-21A1-RK-TP

数据表

8400 Tube Active PLCC 68 (4 x 17) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 160.0µin (4.06µm) Copper Alloy
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