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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
PLCC-52-AT

PLCC-52-AT

PLCC 52P THROUGH HOLE

Adam Tech

1,872 -
PLCC-52-AT

数据表

PLCC Tube Active PLCC 52 (4 x 13) Tin 80.0µin (2.03µm) Phosphor Bronze Through Hole Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 80.0µin (2.03µm) Phosphor Bronze
940-44-028-17-400000

940-44-028-17-400000

CONN SOCKET PLCC 28POS TIN

Mill-Max Manufacturing Corp.

887 -
940-44-028-17-400000

数据表

940 Tube Active PLCC 28 (4 x 7) Tin 150.0µin (3.81µm) Beryllium Copper Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-41-316-41-001000

110-41-316-41-001000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

836 -
110-41-316-41-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
AR 28-HZL/01/7-TT

AR 28-HZL/01/7-TT

CONN IC DIP SOCKET 28POS GOLD

Assmann WSW Components

5,267 -
AR 28-HZL/01/7-TT

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester 200.0µin (5.08µm) Beryllium Copper
110-47-316-41-105000

110-47-316-41-105000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

395 -
110-47-316-41-105000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
PLCC-84-AT-SMT

PLCC-84-AT-SMT

PLCC SOCKET 84P SMT

Adam Tech

183 -
PLCC-84-AT-SMT

数据表

PLCC Tube Active PLCC 84 (4 x 21) Tin 80.0µin (2.03µm) Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 80.0µin (2.03µm) Phosphor Bronze
110-99-328-41-001000

110-99-328-41-001000

CONN IC DIP SOCKET 28POS TINLEAD

Mill-Max Manufacturing Corp.

808 -
110-99-328-41-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
210-43-314-41-001000

210-43-314-41-001000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

427 -
210-43-314-41-001000

数据表

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-99-628-41-001000

110-99-628-41-001000

CONN IC DIP SOCKET 28POS TINLEAD

Mill-Max Manufacturing Corp.

405 -
110-99-628-41-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
8428-21B1-RK-TR

8428-21B1-RK-TR

CONN SOCKET PLCC 28POS TIN

3M

2,750 -
8428-21B1-RK-TR

数据表

8400 Tape & Reel (TR) Active PLCC 28 (4 x 7) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 160.0µin (4.06µm) Copper Alloy
214-44-316-01-670800

214-44-316-01-670800

CONN IC DIP SOCKET 16POS TIN

Mill-Max Manufacturing Corp.

101 -
214-44-316-01-670800

数据表

214 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Tin 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
D0808-42

D0808-42

CONN IC DIP SOCKET 8POS GOLD

Harwin Inc.

2,547 -
D0808-42

数据表

D0 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 196.9µin (5.00µm) Brass
123-87-314-41-001101

123-87-314-41-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

672 -
123-87-314-41-001101

数据表

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
917-93-103-41-005000

917-93-103-41-005000

CONN TRANSIST TO-5 3POS GOLD

Mill-Max Manufacturing Corp.

306 -
917-93-103-41-005000

数据表

917 Tube Active Transistor, TO-5 3 (Round) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame - Solder - -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
8444-21A1-RK-TP

8444-21A1-RK-TP

CONN SOCKET PLCC 44POS TIN

3M

216 -
8444-21A1-RK-TP

数据表

8400 Tube Active PLCC 44 (4 x 11) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 160.0µin (4.06µm) Copper Alloy
110-41-318-41-001000

110-41-318-41-001000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

516 -
110-41-318-41-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-47-628-41-001000

110-47-628-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

329 -
110-47-628-41-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
AR 28-HZL-TT

AR 28-HZL-TT

CONN IC DIP SOCKET 28POS TIN

Assmann WSW Components

2,066 -
AR 28-HZL-TT

数据表

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester 200.0µin (5.08µm) Beryllium Copper
917-43-104-41-005000

917-43-104-41-005000

CONN TRANSIST TO-5 4POS GOLD

Mill-Max Manufacturing Corp.

466 -
917-43-104-41-005000

数据表

917 Tube Active Transistor, TO-5 4 (Round) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame - Solder - -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
917-93-104-41-005000

917-93-104-41-005000

CONN TRANSIST TO-5 4POS GOLD

Mill-Max Manufacturing Corp.

323 -
917-93-104-41-005000

数据表

917 Tube Active Transistor, TO-5 4 (Round) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame - Solder - -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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