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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
ICM-328-1-GT-HT

ICM-328-1-GT-HT

MACHINE PIN SOCKET, IC, DIP, 28P

Adam Tech

789 -
ICM-328-1-GT-HT

数据表

ICM Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polyphenylene Sulfide (PPS) - Beryllium Copper
ICM-632-1-GT-HT

ICM-632-1-GT-HT

MACHINE PIN SOCKET, IC, DIP, 32P

Adam Tech

988 -
ICM-632-1-GT-HT

数据表

ICM Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polyphenylene Sulfide (PPS) - Beryllium Copper
110-44-316-41-001000

110-44-316-41-001000

CONN IC DIP SOCKET 16POS TIN

Mill-Max Manufacturing Corp.

1,448 -
110-44-316-41-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-87-316-41-001101

110-87-316-41-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

2,092 -
110-87-316-41-001101

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
4840-6004-CP

4840-6004-CP

CONN IC DIP SOCKET 40POS TIN

3M

2,195 -
4840-6004-CP

数据表

4800 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -25°C ~ 85°C Tin Polyester, Glass Filled 35.0µin (0.90µm) Phosphor Bronze
110-87-422-41-001101

110-87-422-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

877 -
110-87-422-41-001101

数据表

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
10-0518-10

10-0518-10

CONN SOCKET SIP 10POS GOLD

Aries Electronics

650 -
10-0518-10

数据表

518 Bulk Active SIP 10 (1 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
14-3518-10

14-3518-10

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

614 -
14-3518-10

数据表

518 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
SA246040

SA246040

CONN IC DIP SOCKET 24POS GOLD

On Shore Technology Inc.

108 -
SA246040

数据表

SA Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Gold Thermoplastic, Polyester, Glass Filled 80.0µin (2.03µm) Brass
210-1-18-003

210-1-18-003

CONN IC DIP SOCKET 18POS GOLD

CNC Tech

3,716 -
210-1-18-003

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT) 200.0µin (5.08µm) Brass
4848-6000-CP

4848-6000-CP

CONN IC DIP SOCKET 48POS TIN

3M

155 -
4848-6000-CP

数据表

4800 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -25°C ~ 85°C Tin Polyester, Glass Filled 35.0µin (0.90µm) Phosphor Bronze
SA283000

SA283000

CONN IC DIP SOCKET 28POS TIN

On Shore Technology Inc.

945 -
SA283000

数据表

SA Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Tin Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester, Glass Filled 200.0µin (5.08µm) Brass
54020-32030LF

54020-32030LF

CONN SOCKET PLCC 32POS TIN

Amphenol ICC (FCI)

5,991 -
54020-32030LF

数据表

- Tube Active PLCC 32 (2 x 7, 2 x 9) Tin 100.0µin (2.54µm) Copper Alloy Through Hole Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polyphenylene Sulfide (PPS) 100.0µin (2.54µm) Copper Alloy
A-CCS 032-Z-T

A-CCS 032-Z-T

CONN SOCKET PLCC 32POS TIN

Assmann WSW Components

2,533 -
A-CCS 032-Z-T

数据表

- Tube Active PLCC 32 (2 x 7, 2 x 9) Tin 160.0µin (4.06µm) Phosphor Bronze Through Hole Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT) 160.0µin (4.06µm) Phosphor Bronze
110-47-316-41-001000

110-47-316-41-001000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

562 -
110-47-316-41-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
A-CCS 028-Z-T

A-CCS 028-Z-T

CONN SOCKET PLCC 28POS TIN

Assmann WSW Components

764 -
A-CCS 028-Z-T

数据表

- Tube Active PLCC 28 (4 x 7) Tin 160.0µin (4.06µm) Phosphor Bronze Through Hole Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT) 160.0µin (4.06µm) Phosphor Bronze
4848-6004-CP

4848-6004-CP

CONN IC DIP SOCKET 48POS TIN

3M

471 -
4848-6004-CP

数据表

4800 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -25°C ~ 85°C Tin Polyester, Glass Filled 35.0µin (0.90µm) Phosphor Bronze
110-44-318-41-001000

110-44-318-41-001000

CONN IC DIP SOCKET 18POS TIN

Mill-Max Manufacturing Corp.

3,196 -
110-44-318-41-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-99-318-41-001000

110-99-318-41-001000

CONN IC DIP SOCKET 18POS TINLEAD

Mill-Max Manufacturing Corp.

688 -
110-99-318-41-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
ICM-642-1-GT-HT

ICM-642-1-GT-HT

MACHINE PIN SOCKET, IC, DIP, 42P

Adam Tech

305 -
ICM-642-1-GT-HT

数据表

ICM Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polyphenylene Sulfide (PPS) - Beryllium Copper
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