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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
123-83-308-41-001101

123-83-308-41-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

2,414 -
123-83-308-41-001101

数据表

123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
8420-21B1-RK-TP

8420-21B1-RK-TP

CONN SOCKET PLCC 20POS TIN

3M

3,538 -
8420-21B1-RK-TP

数据表

8400 Tube Active PLCC 20 (4 x 5) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 160.0µin (4.06µm) Copper Alloy
20-3518-10

20-3518-10

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

511 -
20-3518-10

数据表

518 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
08-3518-11

08-3518-11

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

225 -
08-3518-11

数据表

518 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
A-CCS 052-Z-T

A-CCS 052-Z-T

IC SOCKET PLCC 52POS TIN

Assmann WSW Components

1,119 -
A-CCS 052-Z-T

数据表

- Tube Active PLCC 52 (4 x 13) Tin 160.0µin (4.06µm) Phosphor Bronze Through Hole Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT) 160.0µin (4.06µm) Phosphor Bronze
110-41-314-41-001000

110-41-314-41-001000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

810 -
110-41-314-41-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
D2899-42

D2899-42

CONN IC DIP SOCKET 3POS GOLD

Harwin Inc.

773 -
D2899-42

数据表

D2 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 3 (1 x 3), 2 Loaded Gold Flash Beryllium Copper Through Hole Closed Frame 0.200" (5.08mm) Solder 0.200" (5.08mm) -55°C ~ 125°C Tin Polyamide (PA), Nylon, Glass Filled 196.9µin (5.00µm) Brass
8428-21B1-RK-TP

8428-21B1-RK-TP

CONN SOCKET PLCC 28POS TIN

3M

2,470 -
8428-21B1-RK-TP

数据表

8400 Tube Active PLCC 28 (4 x 7) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 160.0µin (4.06µm) Copper Alloy
8428-11B1-RK-TP

8428-11B1-RK-TP

CONN SOCKET PLCC 28POS TIN

3M

862 -
8428-11B1-RK-TP

数据表

8400 Tube Active PLCC 28 (4 x 7) Tin 160.0µin (4.06µm) Copper Alloy Through Hole Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 160.0µin (4.06µm) Copper Alloy
110-44-624-41-001000

110-44-624-41-001000

CONN IC DIP SOCKET 24POS TIN

Mill-Max Manufacturing Corp.

2,598 -
110-44-624-41-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-44-324-41-001000

110-44-324-41-001000

CONN IC DIP SOCKET 24POS TIN

Mill-Max Manufacturing Corp.

900 -
110-44-324-41-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
SA286000

SA286000

CONN IC DIP SOCKET 28POS GOLD

On Shore Technology Inc.

593 -
SA286000

数据表

SA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester, Glass Filled 200.0µin (5.08µm) Brass
D2820-42

D2820-42

CONN IC DIP SOCKET 20POS GOLD

Harwin Inc.

8,261 -
D2820-42

数据表

D2 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Plastic 196.9µin (5.00µm) Brass
18-3518-10

18-3518-10

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

391 -
18-3518-10

数据表

518 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
ICM-648-1-GT-HT

ICM-648-1-GT-HT

MACHINE PIN SOCKET, IC, DIP, 48P

Adam Tech

729 -
ICM-648-1-GT-HT

数据表

ICM Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polyphenylene Sulfide (PPS) - Beryllium Copper
110-87-324-41-001101

110-87-324-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

1,421 -
110-87-324-41-001101

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
8432-11B1-RK-TP

8432-11B1-RK-TP

CONN SOCKET PLCC 32POS TIN

3M

627 -
8432-11B1-RK-TP

数据表

8400 Tube Active PLCC 32 (2 x 7, 2 x 9) Tin 160.0µin (4.06µm) Copper Alloy Through Hole Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 160.0µin (4.06µm) Copper Alloy
AR 32-HZL/01-TT

AR 32-HZL/01-TT

CONN IC DIP SOCKET 32POS GOLD

Assmann WSW Components

1,868 -
AR 32-HZL/01-TT

数据表

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester 200.0µin (5.08µm) Beryllium Copper
PLCC-68-AT-SMT

PLCC-68-AT-SMT

CONN SOCKET PLCC 68POS PHOS BRNZ

Adam Tech

1,421 -
PLCC-68-AT-SMT

数据表

PLCC Tube Active PLCC 68 (4 x 17) Tin 80.0µin (2.03µm) Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 80.0µin (2.03µm) Phosphor Bronze
110-47-624-41-001000

110-47-624-41-001000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.

291 -
110-47-624-41-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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