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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
110-87-318-41-001101

110-87-318-41-001101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

247 -
110-87-318-41-001101

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
08-4513-10

08-4513-10

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

1,650 -
08-4513-10

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
08-2513-10

08-2513-10

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

293 -
08-2513-10

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
16-3518-10

16-3518-10

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

243 -
16-3518-10

数据表

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
110-99-320-41-001000

110-99-320-41-001000

CONN IC DIP SOCKET 20POS TINLEAD

Mill-Max Manufacturing Corp.

1,808 -
110-99-320-41-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
917-47-103-41-005000

917-47-103-41-005000

CONN SOCKET TRANSIST TO-5 3POS

Mill-Max Manufacturing Corp.

711 -
917-47-103-41-005000

数据表

917 Tube Active Transistor, TO-5 3 (Round) Gold Flash Beryllium Copper Through Hole Closed Frame - Solder - -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-44-320-41-001000

110-44-320-41-001000

CONN IC DIP SOCKET 20POS TIN

Mill-Max Manufacturing Corp.

489 -
110-44-320-41-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
AR 16-HZL/01-TT

AR 16-HZL/01-TT

CONN IC DIP SOCKET 16POS GOLD

Assmann WSW Components

5,069 -
AR 16-HZL/01-TT

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester 200.0µin (5.08µm) Beryllium Copper
SA286040

SA286040

CONN IC DIP SOCKET 28POS GOLD

On Shore Technology Inc.

500 -
SA286040

数据表

SA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Gold Thermoplastic, Polyester, Glass Filled 80.0µin (2.03µm) Brass
SA283040

SA283040

CONN IC DIP SOCKET 28POS GOLD

On Shore Technology Inc.

129 -
SA283040

数据表

SA Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Gold Thermoplastic, Polyester, Glass Filled 80.0µin (2.03µm) Brass
SA326000

SA326000

CONN IC DIP SOCKET 32POS GOLD

On Shore Technology Inc.

237 -
SA326000

数据表

SA Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester, Glass Filled 200.0µin (5.08µm) Brass
115-43-308-41-003000

115-43-308-41-003000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

995 -
115-43-308-41-003000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
PLCC-84-AT

PLCC-84-AT

PLCC 84P THROUGH HOLE

Adam Tech

522 -
PLCC-84-AT

数据表

PLCC Tube Active PLCC 84 (4 x 21) Tin 80.0µin (2.03µm) Phosphor Bronze Through Hole Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 80.0µin (2.03µm) Phosphor Bronze
ICM-640-1-GT-HT

ICM-640-1-GT-HT

MACHINE PIN SOCKET, IC, DIP, 40P

Adam Tech

217 -
ICM-640-1-GT-HT

数据表

ICM Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polyphenylene Sulfide (PPS) - Beryllium Copper
917-47-104-41-005000

917-47-104-41-005000

CONN SOCKET TRANSIST TO-5 4POS

Mill-Max Manufacturing Corp.

804 -
917-47-104-41-005000

数据表

917 Tube Active Transistor, TO-5 4 (Round) Gold Flash Beryllium Copper Through Hole Closed Frame - Solder - -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
114-87-318-41-134161

114-87-318-41-134161

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

495 -
114-87-318-41-134161

数据表

114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-47-320-41-001000

110-47-320-41-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

584 -
110-47-320-41-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
111-93-308-41-001000

111-93-308-41-001000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

2,149 -
111-93-308-41-001000

数据表

111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
D2814-42

D2814-42

CONN IC DIP SOCKET 14POS GOLD

Harwin Inc.

16,792 -
D2814-42

数据表

D2 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Plastic 196.9µin (5.00µm) Brass
8420-11B1-RK-TP

8420-11B1-RK-TP

CONN SOCKET PLCC 20POS TIN

3M

1,048 -
8420-11B1-RK-TP

数据表

8400 Tube Active PLCC 20 (4 x 5) Tin 160.0µin (4.06µm) Copper Alloy Through Hole Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 160.0µin (4.06µm) Copper Alloy
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