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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
ICA-308-ZSTT

ICA-308-ZSTT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-308-ZSTT

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyester, Glass Filled - Brass
300-014-000

300-014-000

CONN SOCKET SIP 14POS GOLD

3M

0 -
300-014-000

数据表

300 - Obsolete SIP 14 (1 x 14) Gold 8.00µin (0.203µm) - Through Hole Closed Frame 0.100" (2.54mm) - 0.100" (2.54mm) - Gold - 8.00µin (0.203µm) -
13-0513-10

13-0513-10

CONN SOCKET SIP 13POS GOLD

Aries Electronics

0 -
13-0513-10

数据表

0513 Bulk Active SIP 13 (1 x 13) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
16-0518-10

16-0518-10

CONN SOCKET SIP 16POS GOLD

Aries Electronics

0 -
16-0518-10

数据表

518 Bulk Active SIP 16 (1 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
05-0517-90C

05-0517-90C

CONN SOCKET SIP 5POS GOLD

Aries Electronics

0 -
05-0517-90C

数据表

0517 Bulk Active SIP 5 (1 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - - Solder - - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
116-83-210-41-001101

116-83-210-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
116-83-210-41-001101

数据表

116 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-83-310-41-001101

116-83-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
116-83-310-41-001101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
540-99-052-24-000000

540-99-052-24-000000

CONN SOCKET PLCC 52POS TIN-LEAD

Mill-Max Manufacturing Corp.

0 -
540-99-052-24-000000

数据表

540 Tube Obsolete PLCC 52 (4 x 13) Tin-Lead 200.0µin (5.08µm) - Through Hole Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) - Tin-Lead Polyphenylene Sulfide (PPS) 200.0µin (5.08µm) -
299-83-306-11-001101

299-83-306-11-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
299-83-306-11-001101

数据表

299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
DIP640-001B

DIP640-001B

DIP640-001B-DIP SOCKET 40 CTS

Amphenol ICC (FCI)

0 -
DIP640-001B

数据表

- Bag Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 200.0µin (5.08µm) Brass
HLS-0103-G-31

HLS-0103-G-31

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0103-G-31

数据表

HLS Tube Active SIP 3 (1 x 3) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
115-87-628-41-003101

115-87-628-41-003101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
115-87-628-41-003101

数据表

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
SIP050-1X19-160B

SIP050-1X19-160B

1X19-160B-SIP SOCKET 19 CTS

Amphenol ICC (FCI)

0 -
SIP050-1X19-160B

数据表

SIP050-1x Bulk Active SIP 19 (1 x 19) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 200.0µin (5.08µm) Brass
116-87-310-41-004101

116-87-310-41-004101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
116-87-310-41-004101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
10-0513-10

10-0513-10

CONN SOCKET SIP 10POS GOLD

Aries Electronics

0 -
10-0513-10

数据表

0513 Bulk Active SIP 10 (1 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
18-3518-10T

18-3518-10T

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-3518-10T

数据表

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
HLS-0106-T-2

HLS-0106-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0106-T-2

数据表

HLS Tube Active SIP 6 (1 x 6) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
2-916783-5

2-916783-5

CONN SOCKET PGA ZIF 370POS GOLD

TE Connectivity AMP Connectors

0 -
2-916783-5

数据表

- Tray Obsolete PGA, ZIF (ZIP) 370 (19 x 19) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Liquid Crystal Polymer (LCP) 15.0µin (0.38µm) Phosphor Bronze
10-0513-11

10-0513-11

CONN SOCKET SIP 10POS GOLD

Aries Electronics

0 -
10-0513-11

数据表

0513 Bulk Active SIP 10 (1 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
17-0518-10T

17-0518-10T

CONN SOCKET SIP 17POS GOLD

Aries Electronics

0 -
17-0518-10T

数据表

518 Bulk Active SIP 17 (1 x 17) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
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