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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
116-83-610-41-008101

116-83-610-41-008101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
116-83-610-41-008101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
614-83-316-41-001101

614-83-316-41-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
614-83-316-41-001101

数据表

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
115-87-432-41-001101

115-87-432-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
115-87-432-41-001101

数据表

115 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
DIP050-628-157B

DIP050-628-157B

DIP SOCKET 28 CTS

Amphenol ICC (FCI)

0 -
DIP050-628-157B

数据表

- Bag Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 200.0µin (5.08µm) Brass
110-83-424-41-001101

110-83-424-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
110-83-424-41-001101

数据表

110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-83-316-41-105161

110-83-316-41-105161

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
110-83-316-41-105161

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
346-43-104-41-013000

346-43-104-41-013000

CONN SOCKET SIP 4POS GOLD

Mill-Max Manufacturing Corp.

0 -
346-43-104-41-013000

数据表

346 Tube Active SIP 4 (1 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-87-624-41-105101

110-87-624-41-105101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
110-87-624-41-105101

数据表

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-83-312-41-002101

116-83-312-41-002101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0 -
116-83-312-41-002101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
115-83-320-41-003101

115-83-320-41-003101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
115-83-320-41-003101

数据表

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
115-83-420-41-003101

115-83-420-41-003101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
115-83-420-41-003101

数据表

115 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
818-AG11D-ES

818-AG11D-ES

CONN IC DIP SOCKET 18POS GOLD

TE Connectivity AMP Connectors

0 -
818-AG11D-ES

数据表

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin-Lead Polyester - Copper Alloy
SIP1X20-041B

SIP1X20-041B

SIP1X20-041B-SIP SOCKET 20 CTS

Amphenol ICC (FCI)

0 -
SIP1X20-041B

数据表

SIP1x Bulk Active SIP 20 (1 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin-Lead Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Brass
110-87-312-41-105191

110-87-312-41-105191

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0 -
110-87-312-41-105191

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-87-632-41-605101

110-87-632-41-605101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
110-87-632-41-605101

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
15-0513-10T

15-0513-10T

CONN SOCKET SIP 15POS GOLD

Aries Electronics

0 -
15-0513-10T

数据表

0513 Bulk Active SIP 15 (1 x 15) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
299-83-306-10-001101

299-83-306-10-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
299-83-306-10-001101

数据表

299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-83-610-41-001101

116-83-610-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
116-83-610-41-001101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
1-1825094-6

1-1825094-6

CONN IC DIP SOCKET 20POS GOLD

TE Connectivity AMP Connectors

0 -
1-1825094-6

数据表

Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Thermoplastic, Glass Filled 30.0µin (0.76µm) Beryllium Copper
110-83-322-41-005101

110-83-322-41-005101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
110-83-322-41-005101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
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