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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
110-87-636-41-005101

110-87-636-41-005101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

0 -
110-87-636-41-005101

数据表

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
SIP050-1X23-157B

SIP050-1X23-157B

1X23-157B-SIP SOCKET 23 CTS

Amphenol ICC (FCI)

0 -
SIP050-1X23-157B

数据表

SIP050-1x Bulk Active SIP 23 (1 x 23) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 200.0µin (5.08µm) Brass
116-87-312-41-011101

116-87-312-41-011101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0 -
116-87-312-41-011101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
12-3513-10T

12-3513-10T

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

0 -
12-3513-10T

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
612-87-324-41-001101

612-87-324-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
612-87-324-41-001101

数据表

612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-83-422-41-005101

110-83-422-41-005101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
110-83-422-41-005101

数据表

110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-83-422-41-605101

110-83-422-41-605101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
110-83-422-41-605101

数据表

110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-87-322-41-018101

116-87-322-41-018101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
116-87-322-41-018101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
HLS-0103-G-38

HLS-0103-G-38

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0103-G-38

数据表

HLS Tube Active SIP 3 (1 x 3) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
211-1-40-006

211-1-40-006

CONN IC DIP SOCKET 40POS GOLD

CNC Tech

0 -
211-1-40-006

数据表

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polybutylene Terephthalate (PBT) 200.0µin (5.08µm) Brass
122-83-312-41-001101

122-83-312-41-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0 -
122-83-312-41-001101

数据表

122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
643647-1

643647-1

CONN SOCKET SIP 15POS TIN

TE Connectivity AMP Connectors

0 -
643647-1

数据表

Diplomate DL Tray Obsolete SIP 15 (1 x 15) Tin - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Thermoplastic, Glass Filled - Beryllium Copper
510-83-028-06-001101

510-83-028-06-001101

CONN SOCKET PGA 28POS GOLD

Preci-Dip

0 -
510-83-028-06-001101

数据表

510 Bulk Active PGA 28 (6 x 6) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
643653-1

643653-1

CONN SOCKET SIP 21POS TIN

TE Connectivity AMP Connectors

0 -
643653-1

数据表

Diplomate DL Box Obsolete SIP 21 (1 x 21) Tin - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Thermoplastic, Glass Filled - Beryllium Copper
110-87-320-41-105191

110-87-320-41-105191

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
110-87-320-41-105191

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
822516-5

822516-5

CONN SOCKET PLCC 68POS TIN

TE Connectivity AMP Connectors

0 -
822516-5

数据表

- Tube Obsolete PLCC 68 (4 x 17) Tin 100.0µin (2.54µm) Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) - Tin Thermoplastic 100.0µin (2.54µm) Phosphor Bronze
114-83-316-41-134191

114-83-316-41-134191

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
114-83-316-41-134191

数据表

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
808-AG11D

808-AG11D

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors

0 -
808-AG11D

数据表

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin-Lead Polyester 80.0µin (2.03µm) Copper Alloy
2-1571550-3

2-1571550-3

CONN IC DIP SOCKET 14POS GOLD

TE Connectivity AMP Connectors

0 -
2-1571550-3

数据表

500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 25.0µin (0.63µm) Beryllium Copper
508-AG10D-ES

508-AG10D-ES

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors

0 -
508-AG10D-ES

数据表

500 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester 25.0µin (0.63µm) Copper Alloy
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