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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
114-87-428-41-117101

114-87-428-41-117101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
114-87-428-41-117101

数据表

114 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-87-318-41-105191

110-87-318-41-105191

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
110-87-318-41-105191

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
614-83-314-31-012101

614-83-314-31-012101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
614-83-314-31-012101

数据表

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
115-87-328-41-003101

115-87-328-41-003101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
115-87-328-41-003101

数据表

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
540-88-028-24-008

540-88-028-24-008

CONN SOCKET PLCC 28POS TIN

Preci-Dip

0 -
540-88-028-24-008

数据表

540 Bulk Active PLCC 28 (4 x 7) Tin - Phosphor Bronze Through Hole Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS) - Phosphor Bronze
121-83-312-41-001101

121-83-312-41-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0 -
121-83-312-41-001101

数据表

121 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
115-83-420-41-001101

115-83-420-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
115-83-420-41-001101

数据表

115 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
510-87-037-10-061101

510-87-037-10-061101

CONN SOCKET PGA 37POS GOLD

Preci-Dip

0 -
510-87-037-10-061101

数据表

510 Bulk Active PGA 37 (10 x 10) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
HLS-0110-TT-2

HLS-0110-TT-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0110-TT-2

数据表

HLS Tube Active SIP 10 (1 x 10) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Tin Thermoplastic - -
08-2513-11

08-2513-11

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0 -
08-2513-11

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
09-0513-10H

09-0513-10H

CONN SOCKET SIP 9POS GOLD

Aries Electronics

0 -
09-0513-10H

数据表

0513 Bulk Active SIP 9 (1 x 9) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
07-0518-11H

07-0518-11H

CONN SOCKET SIP 7POS GOLD

Aries Electronics

0 -
07-0518-11H

数据表

518 Bulk Active SIP 7 (1 x 7) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
15-0518-10H

15-0518-10H

CONN SOCKET SIP 15POS GOLD

Aries Electronics

0 -
15-0518-10H

数据表

518 Bulk Active SIP 15 (1 x 15) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
16-0518-10T

16-0518-10T

CONN SOCKET SIP 16POS GOLD

Aries Electronics

0 -
16-0518-10T

数据表

518 Bulk Active SIP 16 (1 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
18-1518-10

18-1518-10

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-1518-10

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
540-88-032-24-008

540-88-032-24-008

CONN SOCKET PLCC 32POS TIN

Preci-Dip

0 -
540-88-032-24-008

数据表

540 Bulk Active PLCC 32 (4 x 8) Tin - Phosphor Bronze Through Hole Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS) - Phosphor Bronze
10-3513-10T

10-3513-10T

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

0 -
10-3513-10T

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
AR28-HZL/07-TT

AR28-HZL/07-TT

CONN IC DIP SOCKET 28POS GOLD

Assmann WSW Components

0 -
AR28-HZL/07-TT

数据表

- Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester 200.0µin (5.08µm) Beryllium Copper
117-83-620-41-005101

117-83-620-41-005101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
117-83-620-41-005101

数据表

117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
D0816-01

D0816-01

CONN IC DIP SOCKET 16POS GOLD

Harwin Inc.

0 -
D0816-01

数据表

D0 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 196.9µin (5.00µm) Brass
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