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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
110-87-428-41-005101

110-87-428-41-005101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
110-87-428-41-005101

数据表

110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
DIP632-001B

DIP632-001B

DIP632-001B-DIP SOCKET 32 CTS

Amphenol ICC (FCI)

0 -
DIP632-001B

数据表

- Bag Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 200.0µin (5.08µm) Brass
14-0518-10

14-0518-10

14 PIN SOCKET

Aries Electronics

0 -
14-0518-10

数据表

518 - Active SIP 14 (1 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
08-6513-10

08-6513-10

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0 -
08-6513-10

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
11-0513-10T

11-0513-10T

CONN SOCKET SIP 11POS GOLD

Aries Electronics

0 -
11-0513-10T

数据表

0513 Bulk Active SIP 11 (1 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
14-1518-10

14-1518-10

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
14-1518-10

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
122-83-310-41-001101

122-83-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
122-83-310-41-001101

数据表

122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
123-83-310-41-001101

123-83-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
123-83-310-41-001101

数据表

123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
614-87-316-31-012101

614-87-316-31-012101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
614-87-316-31-012101

数据表

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
SMPX-20LCC-P

SMPX-20LCC-P

SMT PLCC SOCKET 20P POLARISED RO

Kycon, Inc.

0 -
SMPX-20LCC-P

数据表

SMPX Tube Active PLCC 20 (4 x 5) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Board Guide, Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -50°C ~ 105°C Tin Thermoplastic, Glass Filled - Phosphor Bronze
1825094-7

1825094-7

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors

0 -
1825094-7

数据表

Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Thermoplastic, Glass Filled 15.0µin (0.38µm) Phosphor Bronze
SMPX-44LCC-N

SMPX-44LCC-N

SMT PLCC SOCKET 44P NON POLARISE

Kycon, Inc.

0 -
SMPX-44LCC-N

数据表

SMPX Tube Active PLCC 44 (4 x 11) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -50°C ~ 105°C Tin Thermoplastic, Glass Filled - Phosphor Bronze
HLS-0102-G-31

HLS-0102-G-31

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0102-G-31

数据表

HLS Tube Active SIP 2 (1 x 2) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
115-87-624-41-001101

115-87-624-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
115-87-624-41-001101

数据表

115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-83-304-41-013101

116-83-304-41-013101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
116-83-304-41-013101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
540-88-084-17-400

540-88-084-17-400

CONN SOCKET PLCC 84POS TIN

Preci-Dip

0 -
540-88-084-17-400

数据表

540 Bulk Obsolete PLCC 84 (4 x 21) Tin - Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS) - Phosphor Bronze
D01-9950842

D01-9950842

CONN SOCKET SIP 8POS GOLD

Harwin Inc.

0 -
D01-9950842

数据表

D01-995 Tube Obsolete SIP 8 (1 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 196.9µin (5.00µm) Brass
116-87-312-41-002101

116-87-312-41-002101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0 -
116-87-312-41-002101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-87-328-01-762101

110-87-328-01-762101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
110-87-328-01-762101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14), 16 Loaded Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
08-0518-00

08-0518-00

CONN SOCKET SIP 8POS GOLD

Aries Electronics

0 -
08-0518-00

数据表

518 Bulk Active SIP 8 (1 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
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