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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
1825108-1

1825108-1

CONN IC DIP SOCKET 24POS GOLD

TE Connectivity AMP Connectors

0 -
1825108-1

数据表

Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Thermoplastic, Glass Filled 15.0µin (0.38µm) Phosphor Bronze
506-AG11D-ESL

506-AG11D-ESL

CONN IC DIP SOCKET 6POS GOLD

TE Connectivity AMP Connectors

0 -
506-AG11D-ESL

数据表

500 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold - Copper Alloy Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester - Copper Alloy
540-88-068-17-400-TR

540-88-068-17-400-TR

CONN SOCKET PLCC 68POS TIN

Preci-Dip

0 -
540-88-068-17-400-TR

数据表

540 Tape & Reel (TR) Obsolete PLCC 68 (4 x 17) Tin - Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS) - Phosphor Bronze
114-87-424-41-117101

114-87-424-41-117101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
114-87-424-41-117101

数据表

114 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
SIP1X16-041B

SIP1X16-041B

SIP1X16-041B-SIP SOCKET 16 CTS

Amphenol ICC (FCI)

0 -
SIP1X16-041B

数据表

SIP1x Bulk Active SIP 16 (1 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin-Lead Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Brass
115-87-324-41-003101

115-87-324-41-003101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
115-87-324-41-003101

数据表

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
540-99-044-17-400000

540-99-044-17-400000

CONN SOCKET PLCC 44POS TIN-LEAD

Mill-Max Manufacturing Corp.

0 -
540-99-044-17-400000

数据表

540 Tube Obsolete PLCC 44 (4 x 11) Tin-Lead 200.0µin (5.08µm) - Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) - Tin-Lead Polyphenylene Sulfide (PPS) 200.0µin (5.08µm) -
540-99-044-17-400200

540-99-044-17-400200

CONN SOCKET PLCC 44POS TIN-LEAD

Mill-Max Manufacturing Corp.

0 -
540-99-044-17-400200

数据表

540 Tube Obsolete PLCC 44 (4 x 11) Tin-Lead 200.0µin (5.08µm) - Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) - Tin-Lead Polyphenylene Sulfide (PPS) 200.0µin (5.08µm) -
HLS-0202-T-10

HLS-0202-T-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0202-T-10

数据表

HLS Tube Active SIP 4 (2 x 2) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
614-83-312-31-012101

614-83-312-31-012101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0 -
614-83-312-31-012101

数据表

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
AR22-HZW/T

AR22-HZW/T

CONN IC DIP SOCKET 22POS GOLD

Assmann WSW Components

0 -
AR22-HZW/T

数据表

- Bag Obsolete DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester 200.0µin (5.08µm) Beryllium Copper
115-83-316-41-003101

115-83-316-41-003101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
115-83-316-41-003101

数据表

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
HLS-0103-T-11

HLS-0103-T-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0103-T-11

数据表

HLS Tube Active SIP 3 (1 x 3) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
AR24-HZL/07-TT

AR24-HZL/07-TT

CONN IC DIP SOCKET 24POS GOLD

Assmann WSW Components

0 -
AR24-HZL/07-TT

数据表

- Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester 200.0µin (5.08µm) Beryllium Copper
614-87-320-41-001101

614-87-320-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
614-87-320-41-001101

数据表

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
D95008-42

D95008-42

CONN IC DIP SOCKET 8POS GOLD

Harwin Inc.

0 -
D95008-42

数据表

D95 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 196.9µin (5.00µm) Brass
116-83-310-41-007101

116-83-310-41-007101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
116-83-310-41-007101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-83-306-41-004101

116-83-306-41-004101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
116-83-306-41-004101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
15-0518-10

15-0518-10

CONN SOCKET SIP 15POS GOLD

Aries Electronics

0 -
15-0518-10

数据表

518 Bulk Active SIP 15 (1 x 15) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
HLS-0105-T-2

HLS-0105-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0105-T-2

数据表

HLS Tube Active SIP 5 (1 x 5) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
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