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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
110-87-318-41-105101

110-87-318-41-105101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
110-87-318-41-105101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
115-87-324-41-001101

115-87-324-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
115-87-324-41-001101

数据表

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
2-1437539-9

2-1437539-9

CONN IC DIP SOCKET 16POS GOLD

TE Connectivity AMP Connectors

0 -
2-1437539-9

数据表

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 5.00µin (0.127µm) Copper Alloy Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C - Polyester - -
114-87-422-41-117101

114-87-422-41-117101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
114-87-422-41-117101

数据表

114 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-83-316-41-005101

110-83-316-41-005101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
110-83-316-41-005101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-83-316-41-605101

110-83-316-41-605101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
110-83-316-41-605101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
08-0513-10

08-0513-10

CONN SOCKET SIP 8POS GOLD

Aries Electronics

0 -
08-0513-10

数据表

0513 Bulk Active SIP 8 (1 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
116-87-316-41-018101

116-87-316-41-018101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
116-87-316-41-018101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
114-87-316-41-134191

114-87-316-41-134191

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
114-87-316-41-134191

数据表

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-87-312-41-007101

116-87-312-41-007101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0 -
116-87-312-41-007101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
SIP1X32-014B

SIP1X32-014B

SIP1X32-014B-SIP SOCKET 32 CTS

Amphenol ICC (FCI)

0 -
SIP1X32-014B

数据表

SIP1x Bulk Active SIP 32 (1 x 32) Tin-Lead 150.0µin (3.81µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin-Lead Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Brass
110-87-328-01-777101

110-87-328-01-777101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
110-87-328-01-777101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14), 14 Loaded Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-83-308-41-002101

116-83-308-41-002101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
116-83-308-41-002101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-87-432-41-001101

110-87-432-41-001101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
110-87-432-41-001101

数据表

110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-83-312-41-006101

116-83-312-41-006101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0 -
116-83-312-41-006101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
SIP1X14-041B

SIP1X14-041B

SIP1X14-041B-SIP SOCKET 14 CTS

Amphenol ICC (FCI)

0 -
SIP1X14-041B

数据表

SIP1x Bulk Active SIP 14 (1 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin-Lead Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Brass
0010182031

0010182031

CONN SOCKET TRANSIST TO-220 3POS

Molex

0 -
0010182031

数据表

4038 - Obsolete Transistor, TO-220 3 (Rectangular) Tin - Brass Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyester, Glass Filled 100.0µin (2.54µm) Brass
110-83-318-41-001101

110-83-318-41-001101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
110-83-318-41-001101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-83-318-41-001151

110-83-318-41-001151

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
110-83-318-41-001151

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame, No Center Bar 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
115-87-424-41-001101

115-87-424-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
115-87-424-41-001101

数据表

115 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
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