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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
05-0518-11H

05-0518-11H

CONN SOCKET SIP 5POS GOLD

Aries Electronics

0 -
05-0518-11H

数据表

518 Bulk Active SIP 5 (1 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
13-0518-10

13-0518-10

CONN SOCKET SIP 13POS GOLD

Aries Electronics

0 -
13-0518-10

数据表

518 Bulk Active SIP 13 (1 x 13) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
03-0508-30

03-0508-30

CONN SOCKET SIP 3POS GOLD

Aries Electronics

0 -
03-0508-30

数据表

508 Bulk Active SIP 3 (1 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
SIP1X27-014B

SIP1X27-014B

SIP1X27-014B-SIP SOCKET 27 CTS

Amphenol ICC (FCI)

0 -
SIP1X27-014B

数据表

SIP1x Bulk Active SIP 27 (1 x 27) Tin-Lead 150.0µin (3.81µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin-Lead Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Brass
116-87-610-41-007101

116-87-610-41-007101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
116-87-610-41-007101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-83-312-41-105101

110-83-312-41-105101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0 -
110-83-312-41-105101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-87-324-41-605101

110-87-324-41-605101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
110-87-324-41-605101

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-87-324-41-005101

110-87-324-41-005101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
110-87-324-41-005101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
HLS-0102-G-12

HLS-0102-G-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0102-G-12

数据表

HLS Tube Active SIP 2 (1 x 2) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
ARO 64-HZL/NEC-T

ARO 64-HZL/NEC-T

SOCKET

Assmann WSW Components

0 -
ARO 64-HZL/NEC-T

数据表

- Bulk Active - - - - - - - - - - - - - - -
540-99-032-24-000000

540-99-032-24-000000

CONN SOCKET PLCC 32POS TIN-LEAD

Mill-Max Manufacturing Corp.

0 -
540-99-032-24-000000

数据表

540 Tube Obsolete PLCC 32 (2 x 7, 2 x 9) Tin-Lead 200.0µin (5.08µm) - Through Hole Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) - Tin-Lead Polyphenylene Sulfide (PPS) 200.0µin (5.08µm) -
AR24-HZL/7/07-TT

AR24-HZL/7/07-TT

CONN IC DIP SOCKET 24POS GOLD

Assmann WSW Components

0 -
AR24-HZL/7/07-TT

数据表

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester 200.0µin (5.08µm) Beryllium Copper
ED044PLCZ

ED044PLCZ

CONN SOCKET PLCC 44POS TIN

On Shore Technology Inc.

0 -
ED044PLCZ

数据表

ED Tube Active PLCC 44 (2 x 22) Tin - Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polybutylene Terephthalate (PBT) - Phosphor Bronze
A-ICS-254-08-TT50

A-ICS-254-08-TT50

IC SOCKET, MACHINED PIN, 7.62MM,

Assmann WSW Components

0 -
A-ICS-254-08-TT50

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 Nickel 78.7µin (2.00µm) Beryllium Copper Through Hole, Right Angle Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 78.7µin (2.00µm) Brass
D2614-42

D2614-42

CONN IC DIP SOCKET 14POS GOLD

Harwin Inc.

0 -
D2614-42

数据表

D26 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 196.9µin (5.00µm) Brass
AR 32 HGL-TT

AR 32 HGL-TT

SOCKET

Assmann WSW Components

0 -
AR 32 HGL-TT

数据表

AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 32 Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Gold Polybutylene Terephthalate (PBT), Glass Filled Flash Brass
116-83-308-41-009101

116-83-308-41-009101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
116-83-308-41-009101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
10-2513-10T

10-2513-10T

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

0 -
10-2513-10T

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
09-0518-11

09-0518-11

CONN SOCKET SIP 9POS GOLD

Aries Electronics

0 -
09-0518-11

数据表

518 Bulk Active SIP 9 (1 x 9) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
11-0518-10H

11-0518-10H

CONN SOCKET SIP 11POS GOLD

Aries Electronics

0 -
11-0518-10H

数据表

518 Bulk Active SIP 11 (1 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
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