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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
614-87-314-31-012101

614-87-314-31-012101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
614-87-314-31-012101

数据表

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
05-0513-10H

05-0513-10H

CONN SOCKET SIP 5POS GOLD

Aries Electronics

0 -
05-0513-10H

数据表

0513 Bulk Active SIP 5 (1 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
110-87-624-41-005101

110-87-624-41-005101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
110-87-624-41-005101

数据表

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-87-624-41-605101

110-87-624-41-605101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
110-87-624-41-605101

数据表

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
AR48-HZL-TT

AR48-HZL-TT

CONN IC DIP SOCKET 48POS TIN

Assmann WSW Components

0 -
AR48-HZL-TT

数据表

- Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester 200.0µin (5.08µm) Beryllium Copper
A-CCS52-G

A-CCS52-G

CONN SOCKET PLCC 52POS GOLD

Assmann WSW Components

0 -
A-CCS52-G

数据表

- Bag Obsolete PLCC 52 (4 x 13) Gold - Phosphor Bronze Through Hole Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
612-87-316-41-001101

612-87-316-41-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
612-87-316-41-001101

数据表

612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-87-308-41-011101

116-87-308-41-011101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
116-87-308-41-011101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
115-87-322-41-001101

115-87-322-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
115-87-322-41-001101

数据表

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
AR 52-HGL-TT

AR 52-HGL-TT

SOCKET

Assmann WSW Components

0 -
AR 52-HGL-TT

数据表

AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Gold Polybutylene Terephthalate (PBT), Glass Filled Flash Brass
06-6513-10

06-6513-10

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

0 -
06-6513-10

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
08-3513-10T

08-3513-10T

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0 -
08-3513-10T

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
08-6513-10T

08-6513-10T

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0 -
08-6513-10T

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
07-0518-00

07-0518-00

CONN SOCKET SIP 7POS GOLD

Aries Electronics

0 -
07-0518-00

数据表

518 Bulk Active SIP 7 (1 x 7) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
11-0518-10T

11-0518-10T

CONN SOCKET SIP 11POS GOLD

Aries Electronics

0 -
11-0518-10T

数据表

518 Bulk Active SIP 11 (1 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
ED068PLCZ-SM-N

ED068PLCZ-SM-N

CONN SOCKET PLCC 68POS

On Shore Technology Inc.

0 -
ED068PLCZ-SM-N

数据表

ED Tube Active PLCC 68 (2 x 34) - - Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 105°C - Polyphenylene Sulfide (PPS) - Phosphor Bronze
A-CCS68-G

A-CCS68-G

CONN SOCKET PLCC 68POS GOLD

Assmann WSW Components

0 -
A-CCS68-G

数据表

- Bag Obsolete PLCC 68 (4 x 17) Gold - Phosphor Bronze Through Hole Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
1-1437535-9

1-1437535-9

CONN IC DIP SOCKET 8POS TIN

TE Connectivity AMP Connectors

0 -
1-1437535-9

数据表

500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Tin - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin - - Brass
A28-LCG-T-R

A28-LCG-T-R

CONN IC DIP SOCKET 28POS GOLD

Assmann WSW Components

0 -
A28-LCG-T-R

数据表

- Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold - - Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polybutylene Terephthalate (PBT), Glass Filled - -
506-AG12D-LF

506-AG12D-LF

CONN IC DIP SOCKET 6POS TIN

TE Connectivity AMP Connectors

0 -
506-AG12D-LF

数据表

500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Tin - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Beryllium Copper
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