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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
HLS-0101-G-11

HLS-0101-G-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0101-G-11

数据表

HLS Tube Active SIP 1 (1 x 1) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
8428-21A1-RK-TP

8428-21A1-RK-TP

CONN SOCKET PLCC 28POS TIN

3M

0 -
8428-21A1-RK-TP

数据表

8400 Tube Active PLCC 28 (4 x 7) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 160.0µin (4.06µm) Copper Alloy
08-1518-10H

08-1518-10H

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0 -
08-1518-10H

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
SMPX-28LCC-N-TR

SMPX-28LCC-N-TR

SMT PLCC 28P NON POLARISED, T&R

Kycon, Inc.

0 -
SMPX-28LCC-N-TR

数据表

SMPX Tape & Reel (TR) Active PLCC 28 (4 x 7) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -50°C ~ 105°C Tin Thermoplastic, Glass Filled - Phosphor Bronze
SMPX-32LCC-N-TR

SMPX-32LCC-N-TR

SMT PLCC 32P NON POLARISED, T&R

Kycon, Inc.

0 -
SMPX-32LCC-N-TR

数据表

SMPX Tape & Reel (TR) Active PLCC 32 (2 x 7, 2 x 9) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -50°C ~ 105°C Tin Thermoplastic, Glass Filled - Phosphor Bronze
14-3518-10T

14-3518-10T

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
14-3518-10T

数据表

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
10-0518-10H

10-0518-10H

CONN SOCKET SIP 10POS GOLD

Aries Electronics

0 -
10-0518-10H

数据表

518 Bulk Active SIP 10 (1 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
10-1518-10H

10-1518-10H

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

0 -
10-1518-10H

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
12-0518-10

12-0518-10

CONN SOCKET SIP 12POS GOLD

Aries Electronics

0 -
12-0518-10

数据表

518 Bulk Active SIP 12 (1 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
12-1518-10

12-1518-10

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

0 -
12-1518-10

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 12 (2 x 6) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
116-87-312-41-012101

116-87-312-41-012101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0 -
116-87-312-41-012101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
SMPX-44LCC-N-TR

SMPX-44LCC-N-TR

SMT PLCC 44P NON POLARISED, T&R

Kycon, Inc.

0 -
SMPX-44LCC-N-TR

数据表

SMPX Tape & Reel (TR) Active PLCC 44 (4 x 11) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -50°C ~ 105°C Tin Thermoplastic, Glass Filled - Phosphor Bronze
DIP628-001B

DIP628-001B

DIP628-001B-DIP SOCKET 28 CTS

Amphenol ICC (FCI)

0 -
DIP628-001B

数据表

- Bag Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 200.0µin (5.08µm) Brass
114-87-420-41-117101

114-87-420-41-117101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
114-87-420-41-117101

数据表

114 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
115-87-320-41-003101

115-87-320-41-003101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
115-87-320-41-003101

数据表

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
SMPX-28LCC-N

SMPX-28LCC-N

SMT PLCC SOCKET 28P NON POLARISE

Kycon, Inc.

0 -
SMPX-28LCC-N

数据表

SMPX Tube Active PLCC 28 (4 x 7) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -50°C ~ 105°C Tin Thermoplastic, Glass Filled - Phosphor Bronze
AR 22-HZL/01/7-TT

AR 22-HZL/01/7-TT

SOCKET

Assmann WSW Components

0 -
AR 22-HZL/01/7-TT

数据表

AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Brass Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled - Brass
614-83-210-31-012101

614-83-210-31-012101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
614-83-210-31-012101

数据表

614 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
614-83-310-31-012101

614-83-310-31-012101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
614-83-310-31-012101

数据表

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
614-83-610-31-012101

614-83-610-31-012101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
614-83-610-31-012101

数据表

614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
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