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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
A-CCS44-G

A-CCS44-G

CONN SOCKET PLCC 44POS GOLD

Assmann WSW Components

0 -
A-CCS44-G

数据表

- Bag Obsolete PLCC 44 (4 x 11) Gold - Phosphor Bronze Through Hole Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
121-83-308-41-001101

121-83-308-41-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
121-83-308-41-001101

数据表

121 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
A-CCS 068-Z-SM

A-CCS 068-Z-SM

IC SOCKET PLCC 68POS TIN SMD

Assmann WSW Components

0 -
A-CCS 068-Z-SM

数据表

- Tube Active PLCC 68 (4 x 17) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -40°C ~ 105°C Tin Polyamide (PA9T), Nylon 9T, Glass Filled 160.0µin (4.06µm) Phosphor Bronze
110-83-310-41-105161

110-83-310-41-105161

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
110-83-310-41-105161

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
A-CCS84-Z-SM-R

A-CCS84-Z-SM-R

CONN SOCKET PLCC 84POS TIN

Assmann WSW Components

0 -
A-CCS84-Z-SM-R

数据表

- Tube Obsolete PLCC 84 (4 x 21) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 150.0µin (3.81µm) Phosphor Bronze
124-83-306-41-002101

124-83-306-41-002101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
124-83-306-41-002101

数据表

124 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
117-87-620-41-005101

117-87-620-41-005101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
117-87-620-41-005101

数据表

117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) Gold Flash Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
2-641615-4

2-641615-4

CONN IC DIP SOCKET 28POS GOLD

TE Connectivity AMP Connectors

0 -
2-641615-4

数据表

Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Thermoplastic, Glass Filled 15.0µin (0.38µm) Phosphor Bronze
116-83-610-41-006101

116-83-610-41-006101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
116-83-610-41-006101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
540-88-032-17-400-TR

540-88-032-17-400-TR

CONN SOCKET PLCC 32POS TIN

Preci-Dip

0 -
540-88-032-17-400-TR

数据表

540 Tape & Reel (TR) Active PLCC 32 (4 x 8) Tin - Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS) - Phosphor Bronze
1571552-3

1571552-3

CONN IC DIP SOCKET 14POS TIN

TE Connectivity AMP Connectors

0 -
1571552-3

数据表

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Copper
540-88-052-17-400

540-88-052-17-400

CONN SOCKET PLCC 52POS TIN

Preci-Dip

0 -
540-88-052-17-400

数据表

540 Bulk Obsolete PLCC 52 (4 x 13) Tin - Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS) - Phosphor Bronze
SIP050-1X15-157B

SIP050-1X15-157B

1X15-157B-SIP SOCKET 15 CTS

Amphenol ICC (FCI)

0 -
SIP050-1X15-157B

数据表

SIP050-1x Bulk Active SIP 15 (1 x 15) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 200.0µin (5.08µm) Brass
110-024-000

110-024-000

CONN IC DIP SOCKET 24POS GOLD

3M

0 -
110-024-000

数据表

100 Bulk Obsolete DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -65°C ~ 125°C Gold Polyphenylene Sulfide (PPS), Glass Filled Flash Brass
116-83-306-41-001101

116-83-306-41-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
116-83-306-41-001101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
AR40-HZL-TT

AR40-HZL-TT

CONN IC DIP SOCKET 40POS TIN

Assmann WSW Components

0 -
AR40-HZL-TT

数据表

- Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester 200.0µin (5.08µm) Beryllium Copper
HLS-0103-T-10

HLS-0103-T-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0103-T-10

数据表

HLS Tube Active SIP 3 (1 x 3) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
116-87-210-41-002101

116-87-210-41-002101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
116-87-210-41-002101

数据表

116 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-87-310-41-002101

116-87-310-41-002101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
116-87-310-41-002101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
1571552-2

1571552-2

CONN IC DIP SOCKET 8POS TIN

TE Connectivity AMP Connectors

0 -
1571552-2

数据表

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Copper
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