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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
2-1571551-3

2-1571551-3

CONN IC DIP SOCKET 14POS GOLD

TE Connectivity AMP Connectors

0 -
2-1571551-3

数据表

500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold Flash Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Flash Nickel
AR20-HZL/07-TT

AR20-HZL/07-TT

CONN IC DIP SOCKET 20POS GOLD

Assmann WSW Components

0 -
AR20-HZL/07-TT

数据表

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester 200.0µin (5.08µm) Beryllium Copper
08-2513-10T

08-2513-10T

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0 -
08-2513-10T

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
08-4513-10T

08-4513-10T

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0 -
08-4513-10T

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
04-0518-11H

04-0518-11H

CONN SOCKET SIP 4POS GOLD

Aries Electronics

0 -
04-0518-11H

数据表

518 Bulk Active SIP 4 (1 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
04-1518-11H

04-1518-11H

CONN IC DIP SOCKET 4POS GOLD

Aries Electronics

0 -
04-1518-11H

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 4 (2 x 2) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
09-0518-10H

09-0518-10H

CONN SOCKET SIP 9POS GOLD

Aries Electronics

0 -
09-0518-10H

数据表

518 Bulk Active SIP 9 (1 x 9) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
HLS-0104-TT-12

HLS-0104-TT-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0104-TT-12

数据表

HLS Tube Active SIP 4 (1 x 4) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Tin Thermoplastic - -
540-99-032-17-400000

540-99-032-17-400000

CONN SOCKET PLCC 32POS TIN-LEAD

Mill-Max Manufacturing Corp.

0 -
540-99-032-17-400000

数据表

540 Tube Obsolete PLCC 32 (2 x 7, 2 x 9) Tin-Lead 200.0µin (5.08µm) - Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) - Tin-Lead Polyphenylene Sulfide (PPS) 200.0µin (5.08µm) -
110-87-422-41-005101

110-87-422-41-005101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
110-87-422-41-005101

数据表

110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-87-422-41-605101

110-87-422-41-605101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
110-87-422-41-605101

数据表

110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
ED052PLCZ-SM-N

ED052PLCZ-SM-N

CONN SOCKET PLCC 52POS

On Shore Technology Inc.

0 -
ED052PLCZ-SM-N

数据表

ED Tube Active PLCC 52 (2 x 26) - - Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 105°C - Polyphenylene Sulfide (PPS) - Phosphor Bronze
612-83-310-41-001101

612-83-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
612-83-310-41-001101

数据表

612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
A-CCS 052-Z-SM

A-CCS 052-Z-SM

CONN SOCKET PLCC 52POS TIN

Assmann WSW Components

0 -
A-CCS 052-Z-SM

数据表

- Tube Active PLCC 52 (4 x 13) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -40°C ~ 105°C Tin Polyamide (PA9T), Nylon 9T, Glass Filled 160.0µin (4.06µm) Phosphor Bronze
SIP050-1X12-160B

SIP050-1X12-160B

1X12-160B-SIP SOCKET 12 CTS

Amphenol ICC (FCI)

0 -
SIP050-1X12-160B

数据表

SIP050-1x Bulk Active SIP 12 (1 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 200.0µin (5.08µm) Brass
540-99-020-17-400000

540-99-020-17-400000

CONN SOCKET PLCC 20POS TIN-LEAD

Mill-Max Manufacturing Corp.

0 -
540-99-020-17-400000

数据表

540 Tube Obsolete PLCC 20 (4 x 5) Tin-Lead 200.0µin (5.08µm) - Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) - Tin-Lead Polyphenylene Sulfide (PPS) 200.0µin (5.08µm) -
540-99-020-17-400200

540-99-020-17-400200

CONN SOCKET PLCC 20POS TIN-LEAD

Mill-Max Manufacturing Corp.

0 -
540-99-020-17-400200

数据表

540 Tube Obsolete PLCC 20 (4 x 5) Tin-Lead 200.0µin (5.08µm) - Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) - Tin-Lead Polyphenylene Sulfide (PPS) 200.0µin (5.08µm) -
115-87-318-41-003101

115-87-318-41-003101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
115-87-318-41-003101

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
0787250002

0787250002

CONN CAMERA SOCKET 18POS GOLD

Molex

0 -
0787250002

数据表

78725 Tray Obsolete Camera Socket 18 (2 x 9) Gold 12.0µin (0.30µm) Copper Alloy Surface Mount Closed Frame - Solder - -30°C ~ 85°C Gold Thermoplastic Flash Copper Alloy
110-87-324-41-001151

110-87-324-41-001151

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
110-87-324-41-001151

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Open Frame, No Center Bar 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
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