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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
DIP632-011B

DIP632-011B

DIP632-011B-DIP SOCKET 32 CTS

Amphenol ICC (FCI)

0 -
DIP632-011B

数据表

- Bag Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 200.0µin (5.08µm) Brass
A-CCS52-Z-R

A-CCS52-Z-R

CONN SOCKET PLCC 52POS TIN

Assmann WSW Components

0 -
A-CCS52-Z-R

数据表

- Tube Obsolete PLCC 52 (4 x 13) Tin 150.0µin (3.81µm) Phosphor Bronze Through Hole Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 150.0µin (3.81µm) Phosphor Bronze
116-83-308-41-012101

116-83-308-41-012101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
116-83-308-41-012101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-87-310-41-105191

110-87-310-41-105191

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
110-87-310-41-105191

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
06-3513-10

06-3513-10

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

0 -
06-3513-10

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
116-87-308-41-001101

116-87-308-41-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
116-87-308-41-001101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-87-314-41-105161

110-87-314-41-105161

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
110-87-314-41-105161

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
HLS-0102-G-11

HLS-0102-G-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0102-G-11

数据表

HLS Tube Active SIP 2 (1 x 2) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
HLS-0202-T-2

HLS-0202-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0202-T-2

数据表

HLS Tube Active SIP 4 (2 x 2) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
02-0508-30

02-0508-30

CONN SOCKET SIP 2POS GOLD

Aries Electronics

0 -
02-0508-30

数据表

508 Bulk Active SIP 2 (1 x 2) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
02-1508-30

02-1508-30

CONN IC DIP SOCKET 2POS GOLD

Aries Electronics

0 -
02-1508-30

数据表

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 2 (1 x 2) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
917-83-104-41-053101

917-83-104-41-053101

CONN TRANSIST TO-5 4POS GOLD

Preci-Dip

0 -
917-83-104-41-053101

数据表

917 Bulk Active Transistor, TO-5 4 (Round) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - - Solder - -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
06-2513-10

06-2513-10

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

0 -
06-2513-10

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
06-6513-10T

06-6513-10T

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

0 -
06-6513-10T

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
11-0518-10

11-0518-10

CONN SOCKET SIP 11POS GOLD

Aries Electronics

0 -
11-0518-10

数据表

518 Bulk Active SIP 11 (1 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
03-0517-90C

03-0517-90C

CONN SOCKET SIP 3POS GOLD

Aries Electronics

0 -
03-0517-90C

数据表

0517 Bulk Active SIP 3 (1 x 3) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - - Solder - - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
116-87-210-41-003101

116-87-210-41-003101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
116-87-210-41-003101

数据表

116 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-87-314-41-006101

116-87-314-41-006101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
116-87-314-41-006101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
115-83-312-41-001101

115-83-312-41-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0 -
115-83-312-41-001101

数据表

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
114-87-314-41-134191

114-87-314-41-134191

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
114-87-314-41-134191

数据表

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
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