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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
SIP050-1X13-157B

SIP050-1X13-157B

1X13-157B-SIP SOCKET 13 CTS

Amphenol ICC (FCI)

0 -
SIP050-1X13-157B

数据表

SIP050-1x Bulk Active SIP 13 (1 x 13) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 200.0µin (5.08µm) Brass
110-87-424-41-001101

110-87-424-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
110-87-424-41-001101

数据表

110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
06-2513-10T

06-2513-10T

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

0 -
06-2513-10T

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
06-0518-00

06-0518-00

CONN SOCKET SIP 6POS GOLD

Aries Electronics

0 -
06-0518-00

数据表

518 Bulk Active SIP 6 (1 x 6) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
06-1518-00

06-1518-00

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

0 -
06-1518-00

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
AR28-HZL/7/01-TT

AR28-HZL/7/01-TT

CONN IC DIP SOCKET 28POS GOLD

Assmann WSW Components

0 -
AR28-HZL/7/01-TT

数据表

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester 200.0µin (5.08µm) Beryllium Copper
116-83-306-41-002101

116-83-306-41-002101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
116-83-306-41-002101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
DIP628-011B

DIP628-011B

DIP628-011B-DIP SOCKET 28 CTS

Amphenol ICC (FCI)

0 -
DIP628-011B

数据表

- Bag Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 200.0µin (5.08µm) Brass
116-87-310-41-012101

116-87-310-41-012101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
116-87-310-41-012101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-87-322-41-001151

110-87-322-41-001151

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
110-87-322-41-001151

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold Flash Beryllium Copper Through Hole Open Frame, No Center Bar 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
06-0513-10T

06-0513-10T

CONN SOCKET SIP 6POS GOLD

Aries Electronics

0 -
06-0513-10T

数据表

0513 Bulk Active SIP 6 (1 x 6) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
01-0503-21

01-0503-21

CONN SOCKET SIP 1POS GOLD

Aries Electronics

0 -
01-0503-21

数据表

0503 Bulk Active SIP 1 (1 x 1) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - - Wire Wrap - - Gold Polyamide (PA), Nylon, Glass Filled 10.0µin (0.25µm) Brass
116-87-308-41-009101

116-87-308-41-009101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
116-87-308-41-009101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
1814640-2

1814640-2

CONN IC DIP SOCKET 4POS GOLD

TE Connectivity AMP Connectors

0 -
1814640-2

数据表

- Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold 5.00µin (0.127µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Thermoplastic, Polyester 5.00µin (0.127µm) Brass
614-87-314-41-001101

614-87-314-41-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
614-87-314-41-001101

数据表

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
02-0503-20

02-0503-20

CONN SOCKET SIP 2POS GOLD

Aries Electronics

0 -
02-0503-20

数据表

0503 Bulk Active SIP 2 (1 x 2) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Tin Polyamide (PA), Nylon, Glass Filled 200.0µin (5.08µm) Brass
02-0503-30

02-0503-30

CONN SOCKET SIP 2POS GOLD

Aries Electronics

0 -
02-0503-30

数据表

0503 Bulk Active SIP 2 (1 x 2) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Tin Polyamide (PA), Nylon, Glass Filled 200.0µin (5.08µm) Brass
09-0518-10T

09-0518-10T

CONN SOCKET SIP 9POS GOLD

Aries Electronics

0 -
09-0518-10T

数据表

518 Bulk Active SIP 9 (1 x 9) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
10-1518-10

10-1518-10

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

0 -
10-1518-10

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
A-CCS084-Z-SM/P

A-CCS084-Z-SM/P

SOCKET

Assmann WSW Components

0 -
A-CCS084-Z-SM/P

数据表

- Bulk Active PLCC 84 Tin 160.0µin (4.06µm) Phosphor Bronze Through Hole Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -40°C ~ 105°C Tin Polyphenylene Sulfide (PPS), Glass Filled 160.0µin (4.06µm) Phosphor Bronze
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