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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
110-87-318-41-005101

110-87-318-41-005101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
110-87-318-41-005101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-87-318-41-605101

110-87-318-41-605101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
110-87-318-41-605101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
SIP1X16-011B

SIP1X16-011B

SIP1X16-011B-SIP SOCKET 16 CTS

Amphenol ICC (FCI)

0 -
SIP1X16-011B

数据表

SIP1x Bulk Active SIP 16 (1 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin-Lead Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Brass
115-83-610-41-001101

115-83-610-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
115-83-610-41-001101

数据表

115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-87-610-41-018101

116-87-610-41-018101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
116-87-610-41-018101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
SIP050-1X09-160B

SIP050-1X09-160B

1X09-160B-SIP SOCKET 9 CTS

Amphenol ICC (FCI)

0 -
SIP050-1X09-160B

数据表

SIP050-1x Bulk Active SIP 9 (1 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 200.0µin (5.08µm) Brass
614-87-312-41-001101

614-87-312-41-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0 -
614-87-312-41-001101

数据表

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
212-1-06-003

212-1-06-003

CONN IC DIP SOCKET 6POS GOLD

CNC Tech

0 -
212-1-06-003

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold - Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT) 200.0µin (5.08µm) Brass
AR 18-HZL/01-TT

AR 18-HZL/01-TT

CONN IC DIP SOCKET 18POS GOLD

Assmann WSW Components

0 -
AR 18-HZL/01-TT

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester 200.0µin (5.08µm) Beryllium Copper
SIP050-1X11-157B

SIP050-1X11-157B

1X11-157B-SIP SOCKET 11 CTS

Amphenol ICC (FCI)

0 -
SIP050-1X11-157B

数据表

SIP050-1x Bulk Active SIP 11 (1 x 11) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 200.0µin (5.08µm) Brass
A20-LCG-T-R

A20-LCG-T-R

CONN IC DIP SOCKET 20POS GOLD

Assmann WSW Components

0 -
A20-LCG-T-R

数据表

- Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold - - Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polybutylene Terephthalate (PBT), Glass Filled - -
116-83-304-41-004101

116-83-304-41-004101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
116-83-304-41-004101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
HLS-0103-T-2

HLS-0103-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0103-T-2

数据表

HLS Tube Active SIP 3 (1 x 3) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
940-99-084-17-400000

940-99-084-17-400000

CONN SOCKET PLCC 84POS TIN-LEAD

Mill-Max Manufacturing Corp.

0 -
940-99-084-17-400000

数据表

940 Tube Obsolete PLCC 84 (4 x 21) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
117-87-316-41-005101

117-87-316-41-005101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
117-87-316-41-005101

数据表

117 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold Flash Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
A-CCS32-Z-R

A-CCS32-Z-R

CONN SOCKET PLCC 32POS TIN

Assmann WSW Components

0 -
A-CCS32-Z-R

数据表

- Tube Obsolete PLCC 32 (2 x 7, 2 x 9) Tin 150.0µin (3.81µm) Phosphor Bronze Through Hole Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 150.0µin (3.81µm) Phosphor Bronze
114-83-310-41-117101

114-83-310-41-117101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
114-83-310-41-117101

数据表

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
114-83-310-41-134161

114-83-310-41-134161

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
114-83-310-41-134161

数据表

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
07-0518-10H

07-0518-10H

CONN SOCKET SIP 7POS GOLD

Aries Electronics

0 -
07-0518-10H

数据表

518 Bulk Active SIP 7 (1 x 7) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
01-0508-21

01-0508-21

CONN SOCKET SIP 1POS GOLD

Aries Electronics

0 -
01-0508-21

数据表

508 Bulk Active SIP 1 (1 x 1) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - - Wire Wrap - -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
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