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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
123-87-308-41-001101

123-87-308-41-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
123-87-308-41-001101

数据表

123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-87-316-41-605101

110-87-316-41-605101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
110-87-316-41-605101

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-83-610-41-005101

110-83-610-41-005101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
110-83-610-41-005101

数据表

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
03-0513-10H

03-0513-10H

CONN SOCKET SIP 3POS GOLD

Aries Electronics

0 -
03-0513-10H

数据表

0513 Bulk Active SIP 3 (1 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
115-87-314-41-001101

115-87-314-41-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
115-87-314-41-001101

数据表

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
ED028PLCZ-SM-N

ED028PLCZ-SM-N

CONN SOCKET PLCC 28POS

On Shore Technology Inc.

0 -
ED028PLCZ-SM-N

数据表

ED Tube Active PLCC 28 (2 x 14) - - Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 105°C - Polyphenylene Sulfide (PPS) - Phosphor Bronze
822499-1

822499-1

CONN SOCKET PLCC 44POS TIN-LEAD

TE Connectivity AMP Connectors

0 -
822499-1

数据表

- Tube Obsolete PLCC 44 (4 x 11) Tin-Lead - Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) - Tin-Lead Thermoplastic - Phosphor Bronze
AR 36-HGL-TT

AR 36-HGL-TT

SOCKET

Assmann WSW Components

0 -
AR 36-HGL-TT

数据表

AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Gold Polybutylene Terephthalate (PBT), Glass Filled Flash Brass
DIP328-011B

DIP328-011B

DIP328-011B-DIP SOCKET 28 CTS

Amphenol ICC (FCI)

0 -
DIP328-011B

数据表

- Bag Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 200.0µin (5.08µm) Brass
AR 52-HZL-TT

AR 52-HZL-TT

SOCKET

Assmann WSW Components

0 -
AR 52-HZL-TT

数据表

AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 200.0µin (5.08µm) Brass
03-0518-11H

03-0518-11H

CONN SOCKET SIP 3POS GOLD

Aries Electronics

0 -
03-0518-11H

数据表

518 Bulk Active SIP 3 (1 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
07-0518-10T

07-0518-10T

CONN SOCKET SIP 7POS GOLD

Aries Electronics

0 -
07-0518-10T

数据表

518 Bulk Active SIP 7 (1 x 7) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
08-1518-10

08-1518-10

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0 -
08-1518-10

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
A40-LCG

A40-LCG

CONN IC DIP SOCKET 40POS GOLD

Assmann WSW Components

0 -
A40-LCG

数据表

- - Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold - - Through Hole Open Frame 0.100" (2.54mm) - 0.100" (2.54mm) - Gold - - -
116-83-306-41-012101

116-83-306-41-012101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
116-83-306-41-012101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
614-87-210-31-012101

614-87-210-31-012101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
614-87-210-31-012101

数据表

614 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
614-87-310-31-012101

614-87-310-31-012101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
614-87-310-31-012101

数据表

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
HLS-0102-G-2

HLS-0102-G-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0102-G-2

数据表

HLS Tube Active SIP 2 (1 x 2) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
612-83-308-41-001101

612-83-308-41-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
612-83-308-41-001101

数据表

612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
AW 127-39/Z-T

AW 127-39/Z-T

SOCKET 39 CONTACTS SINGLE ROW

Assmann WSW Components

0 -
AW 127-39/Z-T

数据表

- - Active - - - - - - - - - - - - - - -
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