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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
917-87-104-41-005101

917-87-104-41-005101

CONN TRANSIST TO-5 4POS GOLD

Preci-Dip

0 -
917-87-104-41-005101

数据表

917 Bulk Active Transistor, TO-5 4 (Round) Gold Flash Beryllium Copper Through Hole - - Solder - -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
917-87-104-41-053101

917-87-104-41-053101

CONN TRANSIST TO-5 4POS GOLD

Preci-Dip

0 -
917-87-104-41-053101

数据表

917 Bulk Active Transistor, TO-5 4 (Round) Gold Flash Beryllium Copper Through Hole - - Solder - -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
115-83-310-41-003101

115-83-310-41-003101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
115-83-310-41-003101

数据表

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-87-320-41-001101

110-87-320-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
110-87-320-41-001101

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
DIP324-001B

DIP324-001B

DIP324-001B-DIP SOCKET 24 CTS

Amphenol ICC (FCI)

0 -
DIP324-001B

数据表

- Bag Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 200.0µin (5.08µm) Brass
211-1-18-003

211-1-18-003

CONN IC DIP SOCKET 18POS GOLD

CNC Tech

0 -
211-1-18-003

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polybutylene Terephthalate (PBT) 200.0µin (5.08µm) Brass
116-87-306-41-011101

116-87-306-41-011101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
116-87-306-41-011101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
612-87-312-41-001101

612-87-312-41-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0 -
612-87-312-41-001101

数据表

612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-87-610-41-003101

116-87-610-41-003101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
116-87-610-41-003101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
06-0518-11

06-0518-11

CONN SOCKET SIP 6POS GOLD

Aries Electronics

0 -
06-0518-11

数据表

518 Bulk Active SIP 6 (1 x 6) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
06-1518-11

06-1518-11

CONN IC DIP SOCKET 6POS GOLD

Aries Electronics

0 -
06-1518-11

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
08-0518-10T

08-0518-10T

CONN SOCKET SIP 8POS GOLD

Aries Electronics

0 -
08-0518-10T

数据表

518 Bulk Active SIP 8 (1 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
08-1518-10T

08-1518-10T

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0 -
08-1518-10T

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
09-0518-10

09-0518-10

CONN SOCKET SIP 9POS GOLD

Aries Electronics

0 -
09-0518-10

数据表

518 Bulk Active SIP 9 (1 x 9) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
A-CCS052-Z-SM/P

A-CCS052-Z-SM/P

SOCKET

Assmann WSW Components

0 -
A-CCS052-Z-SM/P

数据表

- Bulk Active PLCC 52 Tin 160.0µin (4.06µm) Phosphor Bronze Through Hole Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -40°C ~ 105°C Tin Polyphenylene Sulfide (PPS), Glass Filled 160.0µin (4.06µm) Phosphor Bronze
HLS-0101-G-2

HLS-0101-G-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0101-G-2

数据表

HLS Tube Active SIP 1 (1 x 1) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
03-0513-11

03-0513-11

CONN SOCKET SIP 3POS GOLD

Aries Electronics

0 -
03-0513-11

数据表

0513 Bulk Active SIP 3 (1 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
05-0513-10

05-0513-10

CONN SOCKET SIP 5POS GOLD

Aries Electronics

0 -
05-0513-10

数据表

0513 Bulk Active SIP 5 (1 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
540-88-028-17-400

540-88-028-17-400

CONN SOCKET PLCC 28POS TIN

Preci-Dip

0 -
540-88-028-17-400

数据表

540 Bulk Obsolete PLCC 28 (4 x 7) Tin - Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS) - Phosphor Bronze
116-83-306-41-008101

116-83-306-41-008101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
116-83-306-41-008101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
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