富聪科技订单满¥1000免运费
关注我们:

IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

全部重置
全部应用
结果
图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
WMS-280Z

WMS-280Z

CONN IC DIP SOCKET 28POS GOLD

On Shore Technology Inc.

0 -
WMS-280Z

数据表

WMS Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold Flash Beryllium Copper Through Hole Open Frame, Wash Away 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin - 200.0µin (5.08µm) Brass
AR06-HZW/T-R

AR06-HZW/T-R

CONN IC DIP SOCKET 6POS TIN

Assmann WSW Components

0 -
AR06-HZW/T-R

数据表

- Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester, Glass Filled 200.0µin (5.08µm) Beryllium Copper
AR 20 HGL-TT

AR 20 HGL-TT

SOCKET

Assmann WSW Components

0 -
AR 20 HGL-TT

数据表

AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Gold Polybutylene Terephthalate (PBT), Glass Filled Flash Brass
HLS-0103-TT-12

HLS-0103-TT-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0103-TT-12

数据表

HLS Tube Active SIP 3 (1 x 3) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Tin Thermoplastic - -
110-83-210-41-001101

110-83-210-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
110-83-210-41-001101

数据表

110 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-87-310-41-105101

110-87-310-41-105101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
110-87-310-41-105101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
DIP328-014B

DIP328-014B

DIP328-014B-DIP SOCKET 28 CTS

Amphenol ICC (FCI)

0 -
DIP328-014B

数据表

- Bag Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 200.0µin (5.08µm) Brass
AR28-HZL/7/07-TT

AR28-HZL/7/07-TT

CONN IC DIP SOCKET 28POS GOLD

Assmann WSW Components

0 -
AR28-HZL/7/07-TT

数据表

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester 200.0µin (5.08µm) Beryllium Copper
01-0503-31

01-0503-31

CONN SOCKET SIP 1POS GOLD

Aries Electronics

0 -
01-0503-31

数据表

0503 Bulk Active SIP 1 (1 x 1) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - - Wire Wrap - - Gold Polyamide (PA), Nylon, Glass Filled 30.0µin (0.76µm) Brass
110-87-320-41-001151

110-87-320-41-001151

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
110-87-320-41-001151

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold Flash Beryllium Copper Through Hole Open Frame, No Center Bar 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-87-306-41-001101

116-87-306-41-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
116-87-306-41-001101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
A-CCS32-Z-SM-R

A-CCS32-Z-SM-R

CONN SOCKET PLCC 32POS TIN

Assmann WSW Components

0 -
A-CCS32-Z-SM-R

数据表

- Tube Obsolete PLCC 32 (2 x 7, 2 x 9) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 150.0µin (3.81µm) Phosphor Bronze
A-CCS020-Z-SM/P

A-CCS020-Z-SM/P

SOCKET

Assmann WSW Components

0 -
A-CCS020-Z-SM/P

数据表

- Bulk Active PLCC 20 Tin 160.0µin (4.06µm) Phosphor Bronze Through Hole Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -40°C ~ 105°C Tin Polyphenylene Sulfide (PPS), Glass Filled 160.0µin (4.06µm) Phosphor Bronze
AW 127-38/Z-T

AW 127-38/Z-T

SOCKET 38 CONTACTS SINGLE ROW

Assmann WSW Components

0 -
AW 127-38/Z-T

数据表

- - Active - - - - - - - - - - - - - - -
410-87-214-10-001101

410-87-214-10-001101

CONN ZIG-ZAG 14POS GOLD

Preci-Dip

0 -
410-87-214-10-001101

数据表

410 Bulk Active Zig-Zag 14 (2 x 7) Gold Flash Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
410-87-214-10-002101

410-87-214-10-002101

CONN ZIG-ZAG 14POS GOLD

Preci-Dip

0 -
410-87-214-10-002101

数据表

410 Bulk Active Zig-Zag 14 (2 x 7) Gold Flash Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
124-83-304-41-002101

124-83-304-41-002101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
124-83-304-41-002101

数据表

124 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-87-610-41-006101

116-87-610-41-006101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
116-87-610-41-006101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
1051670001

1051670001

SMIA65 TOP MNT CAMERA SOCKET

Molex

0 -
1051670001

数据表

105167 Tape & Reel (TR) Obsolete Camera Socket 12 (2 x 6) Gold 12.0µin (0.30µm) Copper Alloy Surface Mount Open Frame 0.037" (0.95mm) Solder - -55°C ~ 85°C Gold Thermoplastic Flash Copper Alloy
122-83-306-41-001101

122-83-306-41-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
122-83-306-41-001101

数据表

122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
富聪科技

搜索

富聪科技

产品

富聪科技

电话

富聪科技

用户