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制造商 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理
7178DG

7178DG

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
7178DG

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 0.750" (19.05mm) 0.520" (13.21mm) - 0.375" (9.52mm) Bolt On and PC Pin 0.6W @ 30°C 5.00°C/W @ 700 LFM 35.70°C/W Copper Tin
574602B03300G

574602B03300G

HEATSINK TO-220 CLIP-ON/TAB

Boyd Laconia, LLC

0 -
574602B03300G

数据表

- Bulk Active Board Level, Vertical TO-220 Rectangular, Fins 0.690" (17.53mm) 0.860" (21.84mm) - 0.395" (10.03mm) Clip and PC Pin 3.0W @ 60°C 6.00°C/W @ 600 LFM 21.60°C/W Aluminum Black Anodized
10-L4LB-11G

10-L4LB-11G

HEATSINK BGA W/PUSH PINS

Boyd Laconia, LLC

0 -
10-L4LB-11G

数据表

- Bulk Active Top Mount BGA Square, Pin Fins 1.630" (41.40mm) 1.780" (45.21mm) - 0.461" (11.70mm) Push Pin 4.0W @ 60°C 4.90°C/W @ 200 LFM 14.20°C/W Aluminum Black Anodized
EH-210-H125-T411,FG,(GP)

EH-210-H125-T411,FG,(GP)

EH-210-H125-T411,FG,(GP)

Boyd Laconia, LLC

0 -
EH-210-H125-T411,FG,(GP)

数据表

- Bulk Active - - - - - - - - - - - - -
6399B- P2G

6399B- P2G

6399B- P2G

Boyd Laconia, LLC

0 -
6399B- P2G

数据表

- Bulk Active Board Level, Vertical TO-218, TO-220, TO-247 Rectangular, Fins 1.650" (41.91mm) 1.000" (25.40mm) - 2.000" (50.80mm) Bolt On and PC Pin 6.0W @ 30°C 2.00°C/W @ 300 LFM 3.30°C/W Aluminum Black Anodized
500103B00000G

500103B00000G

HEATSINK TO-3 10W H=.50" BLK

Boyd Laconia, LLC

0 -
500103B00000G

数据表

- Bag Not For New Designs Board Level TO-3 Square, Pin Fins 1.810" (45.97mm) 1.810" (45.97mm) - 0.500" (12.70mm) Bolt On 6.0W @ 50°C 2.50°C/W @ 400 LFM 7.20°C/W Aluminum Black Anodized
508700B00000G

508700B00000G

HEATSINK 40-PIN DIP GLUE-ON BLK

Boyd Laconia, LLC

0 -
508700B00000G

数据表

- Bag Active Top Mount 40-DIP Rectangular, Fins 2.000" (50.80mm) 0.530" (13.46mm) - 0.190" (4.83mm) Thermal Tape, Adhesive (Not Included) 1.0W @ 30°C 16.00°C/W @ 300 LFM 27.20°C/W Aluminum Black Anodized
7148DG

7148DG

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
7148DG

数据表

- Bulk Active Board Level, Vertical Multiwatt, SIP Rectangular, Fins 0.795" (20.19mm) 0.915" (23.24mm) - 0.380" (9.65mm) Clip and PC Pin 1.0W @ 30°C 6.00°C/W @ 600 LFM 16.00°C/W Copper Tin
579003B00000G

579003B00000G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
579003B00000G

数据表

- Bulk Active Board Level TO-3 Rhombus 1.830" (46.48mm) 1.830" (46.48mm) - 1.000" (25.40mm) Bolt On 4.0W @ 30°C 3.50°C/W @ 200 LFM 6.00°C/W Aluminum Black Anodized
7020B-TC12-MTG

7020B-TC12-MTG

7020B-TC12-MTG

Boyd Laconia, LLC

0 -
7020B-TC12-MTG

数据表

- Bulk Active Board Level TO-220 Rectangular, Fins 1.255" (31.88mm) 0.470" (11.94mm) - 1.450" (36.83mm) Bolt On and PC Pin 4.0W @ 40°C 4.00°C/W @ 300 LFM - Aluminum Black Anodized
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