富聪科技订单满¥1000免运费
关注我们:

散热器

制造商 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理

全部重置
全部应用
结果
图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 冷却封装 形状 长度 宽度 直径 Fin 高度 附件方式 功耗 @ 温升 热阻 @ 强制气流 热阻 @ 自然对流 材质 材料表面处理
530101B00100G

530101B00100G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
530101B00100G

数据表

- Bulk Active Board Level, Vertical TO-218, TO-247 Square, Fins 1.750" (44.45mm) 0.490" (12.44mm) - 1.750" (44.45mm) Bolt On and Board Mounts 4.0W @ 30°C 1.50°C/W @ 400 LFM 6.30°C/W Aluminum Black Anodized
6299BG

6299BG

6299BG

Boyd Laconia, LLC

0 -
6299BG

数据表

- Bulk Active Board Level, Vertical TO-218, TO-220 Rectangular, Fins 1.638" (41.60mm) 0.992" (25.20mm) - 2.000" (50.80mm) Bolt On and PC Pin - - 6.70°C/W Aluminum Black Anodized
7129DG

7129DG

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
7129DG

数据表

- Bulk Active Board Level TO-220 Rectangular, Fins 1.040" (26.42mm) 0.866" (22.00mm) - 0.375" (9.52mm) Clip 3.5W @ 70°C 7.00°C/W @ 500 LFM 19.20°C/W Copper Tin
374424B60023G

374424B60023G

374424B60023G

Boyd Laconia, LLC

0 -
374424B60023G

数据表

- Bulk Active Top Mount BGA, FPGA Square, Pin Fins 1.063" (27.00mm) 1.063" (27.00mm) - 0.709" (18.00mm) Solder Anchor 3.0W @ 50°C 6.50°C/W @ 200 LFM 20.30°C/W Aluminum Black Anodized
580200W00000G

580200W00000G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
580200W00000G

数据表

- Bulk Active Top Mount 14-DIP and 16-DIP Rectangular, Fins 0.890" (22.61mm) 0.600" (15.24mm) - 0.410" (10.42mm) Press Fit and PC Pin 1.0W @ 20°C 12.00°C/W @ 200 LFM 20.00°C/W Aluminum Black Anodized
SW25-2G

SW25-2G

THM,ZA3286 REV 6 SW25-2G

Boyd Laconia, LLC

0 -
SW25-2G

数据表

- Bulk Active Board Level, Vertical TO-218, TO-220, TO-247 Rectangular, Fins 0.984" (25.00mm) 1.359" (34.50mm) - 0.492" (12.50mm) Bolt On and PC Pin 2.0W @ 30°C 6.00°C/W @ 400 LFM 13.00°C/W Aluminum Black Anodized
KU-0334-AL-ST-1,2MM-2-A-VE/VZ-

KU-0334-AL-ST-1,2MM-2-A-VE/VZ-

KU-0334-AL-ST-1,2MM-2-A-VE/VZ-

Boyd Laconia, LLC

0 -
KU-0334-AL-ST-1,2MM-2-A-VE/VZ-

数据表

- Bulk Active - - - - - - - - - - - - -
TV58G

TV58G

THM,ZA2102 ISS 4 TV-58G

Boyd Laconia, LLC

0 -
TV58G

数据表

- Bulk Active Board Level TO-220 Rectangular, Fins 0.887" (22.53mm) 0.749" (19.03mm) - 0.433" (11.00mm) Bolt On 1.5W @ 50°C 14.00°C/W @ 400 LFM 30.00°C/W Aluminum Black Anodized
241804B91200G

241804B91200G

241804B91200G

Boyd Laconia, LLC

0 -
241804B91200G

数据表

- Bulk Active Top Mount Eighth Brick DC/DC Converter Rectangular, Fins 2.280" (57.90mm) 0.902" (22.90mm) - 0.449" (11.40mm) Bolt On - 3.00°C/W @ 500 LFM 5.50°C/W - -
325705R00000G

325705R00000G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0 -
325705R00000G

数据表

- Bulk Active Board Level TO-5 Cylindrical - - 0.318" (8.07mm) ID, 0.500" (12.70mm) OD 0.250" (6.35mm) Press Fit 1.0W @ 60°C 35.00°C/W @ 200 LFM 60.00°C/W Aluminum Red Anodized
共 748 条记录«上一页1... 3435363738394041...75下一页»
富聪科技

搜索

富聪科技

产品

富聪科技

电话

富聪科技

用户