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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APH-0820-G-H

APH-0820-G-H

APH-0820-G-H

Samtec Inc.

0 -
APH-0820-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0420-G-H

APH-0420-G-H

APH-0420-G-H

Samtec Inc.

0 -
APH-0420-G-H

数据表

* - Active - - - - - - - - - - - - - - -
110-91-648-61-001000

110-91-648-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-91-648-61-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
124-93-640-41-002000

124-93-640-41-002000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

0 -
124-93-640-41-002000

数据表

124 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
124-43-640-41-002000

124-43-640-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
124-43-640-41-002000

数据表

124 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-41-952-41-001000

126-41-952-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-41-952-41-001000

数据表

126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-91-952-41-001000

126-91-952-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-91-952-41-001000

数据表

126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
ICO-648-ZCGG

ICO-648-ZCGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-648-ZCGG

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
116-93-964-41-006000

116-93-964-41-006000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.

0 -
116-93-964-41-006000

数据表

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-43-964-41-006000

116-43-964-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-964-41-006000

数据表

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
326-93-132-41-003000

326-93-132-41-003000

SOCKET WRAP SOLDERTAIL SIP 32POS

Mill-Max Manufacturing Corp.

0 -
326-93-132-41-003000

数据表

326 Tube Active SIP 32 (1 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APH-1438-T-H

APH-1438-T-H

APH-1438-T-H

Samtec Inc.

0 -
APH-1438-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1638-T-H

APH-1638-T-H

APH-1638-T-H

Samtec Inc.

0 -
APH-1638-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0438-T-H

APH-0438-T-H

APH-0438-T-H

Samtec Inc.

0 -
APH-0438-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0638-T-H

APH-0638-T-H

APH-0638-T-H

Samtec Inc.

0 -
APH-0638-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0838-T-H

APH-0838-T-H

APH-0838-T-H

Samtec Inc.

0 -
APH-0838-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1738-T-H

APH-1738-T-H

APH-1738-T-H

Samtec Inc.

0 -
APH-1738-T-H

数据表

* - Active - - - - - - - - - - - - - - -
116-43-320-61-003000

116-43-320-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-320-61-003000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APA-324-G-B

APA-324-G-B

ADAPTER PLUG

Samtec Inc.

0 -
APA-324-G-B

数据表

APA Bulk Active - 24 (2 x 12) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 20.0µin (0.51µm) Phosphor Bronze
APO-624-G-B

APO-624-G-B

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-624-G-B

数据表

APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 10.0µin (0.25µm) Phosphor Bronze
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