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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APH-1040-T-H

APH-1040-T-H

APH-1040-T-H

Samtec Inc.

0 -
APH-1040-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1740-T-H

APH-1740-T-H

APH-1740-T-H

Samtec Inc.

0 -
APH-1740-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1640-T-H

APH-1640-T-H

APH-1640-T-H

Samtec Inc.

0 -
APH-1640-T-H

数据表

* - Active - - - - - - - - - - - - - - -
110-43-306-61-001000

110-43-306-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-43-306-61-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-44-306-61-001000

110-44-306-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-44-306-61-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
25-0511-11

25-0511-11

CONN SOCKET SIP 25POS GOLD

Aries Electronics

0 -
25-0511-11

数据表

511 Bulk Active SIP 25 (1 x 25) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
123-13-322-41-001000

123-13-322-41-001000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

0 -
123-13-322-41-001000

数据表

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
123-13-422-41-001000

123-13-422-41-001000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

0 -
123-13-422-41-001000

数据表

123 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
110-43-308-61-001000

110-43-308-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-43-308-61-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
111-43-308-61-001000

111-43-308-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-43-308-61-001000

数据表

111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
111-93-308-61-001000

111-93-308-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-93-308-61-001000

数据表

111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-93-308-61-003000

115-93-308-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-93-308-61-003000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
122-11-328-41-001000

122-11-328-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
122-11-328-41-001000

数据表

122 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
122-11-428-41-001000

122-11-428-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
122-11-428-41-001000

数据表

122 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
122-11-628-41-001000

122-11-628-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
122-11-628-41-001000

数据表

122 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
116-47-640-41-001000

116-47-640-41-001000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0 -
116-47-640-41-001000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
714-43-160-31-018000

714-43-160-31-018000

CONN SOCKET SIP 60POS GOLD

Mill-Max Manufacturing Corp.

0 -
714-43-160-31-018000

数据表

714 Bulk Active SIP 60 (1 x 60) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 30.0µin (0.76µm) Brass Alloy
614-93-636-31-012000

614-93-636-31-012000

SOCKET CARRIER LOWPRO .600 36POS

Mill-Max Manufacturing Corp.

0 -
614-93-636-31-012000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-43-636-31-012000

614-43-636-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-43-636-31-012000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
27-0501-21

27-0501-21

CONN SOCKET SIP 27POS GOLD

Aries Electronics

0 -
27-0501-21

数据表

501 Bulk Active SIP 27 (1 x 27) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
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