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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
36-0501-30

36-0501-30

CONN SOCKET SIP 36POS TIN

Aries Electronics

0 -
36-0501-30

数据表

501 Bulk Active SIP 36 (1 x 36) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
110-43-314-61-001000

110-43-314-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-43-314-61-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-44-314-61-001000

110-44-314-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-44-314-61-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-93-314-61-001000

110-93-314-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-93-314-61-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
111-43-314-61-001000

111-43-314-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-43-314-61-001000

数据表

111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-93-314-61-001000

115-93-314-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-93-314-61-001000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
HLS-0412-T-11

HLS-0412-T-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0412-T-11

数据表

HLS Bulk Active SIP 48 (4 x 12) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
104-13-432-41-780000

104-13-432-41-780000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

0 -
104-13-432-41-780000

数据表

104 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) - Gold Thermoplastic 10.0µin (0.25µm) Brass Alloy
104-13-632-41-780000

104-13-632-41-780000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

0 -
104-13-632-41-780000

数据表

104 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) - Gold Thermoplastic 10.0µin (0.25µm) Brass Alloy
110-41-316-61-001000

110-41-316-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-41-316-61-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-44-316-61-001000

110-44-316-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-44-316-61-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-93-316-61-001000

110-93-316-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-93-316-61-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
111-43-316-61-001000

111-43-316-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-43-316-61-001000

数据表

111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-43-316-61-003000

115-43-316-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-43-316-61-003000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-93-316-61-003000

115-93-316-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-93-316-61-003000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-13-320-61-001000

110-13-320-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-13-320-61-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
110-44-320-61-001000

110-44-320-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-44-320-61-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-93-320-61-001000

110-93-320-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-93-320-61-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-99-320-61-001000

110-99-320-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-99-320-61-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
121-13-328-41-001000

121-13-328-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

0 -
121-13-328-41-001000

数据表

121 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
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